Infineon’s EasyPACK™ S module and packaging concept enables compact designs for high-power-density applications

Market News

Jun 02, 2026

Munich, Germany – 2 June 2026 – The demand for higher power densities in increasingly space-constrained environments continues to grow, whether in on-board chargers for electric vehicles or power supplies for AI data centers. At PCIM Europe 2026, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces EasyPACK™ S, a compact power module and packaging concept specifically designed to meet these requirements. With a package height of only 5.6 mm and a footprint of around 33 x 36 mm², EasyPACK S enables significant system miniaturization while ensuring reliable thermal performance and reduced electromagnetic interference. The first modules available in the new package integrate Infineon’s CoolSiC™ MOSFETs 1200 V G2 as well as IGBT4 and IGBT7 1200 V technology. 

EasyPACK S is qualified according to the latest industrial and automotive standards. Leveraging Infineon's .XT interconnection technology, the modules offer enhanced reliability and long lifetime. An integrated direct bonded copper substrate ensures stable thermal performance and uniform temperature distribution. By using a new plastic material and silicone gel, the modules support continuous operating temperatures of up to Tvj(op) = 175°C. PressFIT pins double the current carrying capacity and simplify PCB mounting. The mechanical design enables automated production processes through defined gripping areas, alignment holes and reduced pin to pin tolerance, helping to reduce manufacturing time and cost.

Designed with future requirements in mind, EasyPACK S is suitable for next-generation SiC and GaN devices while meeting stringent lifetime and reliability targets. Its scalable platform architecture offers exceptional design flexibility across semiconductor technologies, chip configurations, topologies and power classes, enabling optimized performance and accelerating design-in. 

Availability

The first EasyPACK S modules featuring CoolSiC MOSFETs G2 and IGBT4 technology will be available starting in July. The products will be demonstrated at the Infineon booth at PCIM 2026 in Nuremberg. More information can be found at https://www.infineon.com/easypack-s. 

Infineon at PCIM Europe 2026

PCIM Europe will take place in Nuremberg, Germany, from 9 to 11 June 2026. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booth 470. For press inquiries, please contact media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2026 show highlights is available at www.infineon.com/pcim.  

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

 

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Infineon’s EasyPACK™ S module and packaging concept enables compact designs for high-power-density applications

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Information Number : infgip202606-097

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Veronika Seifried

Spokesperson Industrial and Infrastructure, GIP Division

+49 89 234 61662

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