EconoDUAL™ 3

Overview

Leading IGBT technology for medium power applications

With the EconoDUAL™ 3 family, Infineon supports the complete current ranges from 100 A up to 600 A at 600 V / 650 V / 1200 V and 1700 V. Excellent mechanical robustness, power cycling capability, the option of PressFIT pins as well as the availability of TIM makes it a reliable, cost effective solution for applications in drives, CAV, wind turbines, solar, and hybrid vehicles. EconoDUAL™ 3 modules are available in 3-level, half-bridge, H-bridge and chopper topologies for efficient inverter designs.

Products
Highlights

EconoDUAL™ 3 with Shunts

Reduced system costs by higher integration

EconoDUAL™ 3 modules are also available with integrated shunt resistors for current monitoring in the AC path. The integration of additional functionality into the IGBT module is a very effective way to optimize the overall system costs of an inverter.

External current sensors are no longer needed. This saves space in the system, reduces material costs and lowers manufacturing efforts.

 Key Features  Main Application
  • 1200 V state of the art IGBT4 technology
  • Integrated shunts resistors for direct current measurement
  • High current measurement accuracy across a wide temperature range
  • Optimized heat spread guarantees effective thermal management
  • PressFIT control pins and screw power terminals
  • TIM – pre-applied thermal interface material to achieve longest lifetime
  • Compact and robust design with molded terminals
Details

Related information about other products in this family

EconoDUAL™ 3 modules are equipped with the state-of-the-art IGBT4 technology supporting junction temperatures of Tvjop = 150°C for highest power density and leading-edge power cycling capability. The symmetrical design of the module enables optimized current sharing between the IGBT half bridges in parallel operation.

 Key Features  Main Application
  • PressFIT control pins for reduced mounting efforts and increased interconnection reliability
  • TIM – pre-applied thermal interface material to achieve longest lifetime
  • NTC integration for temperature control
  • Fast design-in with Evaluation Boards
  • Compact 3-level, half-bridge, H-bridge and chopper configurations with only 17 mm height
  • Parallel operation enabled by symmetrical design
  • Tvjop 150°C

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Recommended Documents

Simulation
Videos

PressFIT Technology

3:00

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material

3:03

A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

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