High voltage TOLT

High-voltage top-side cooled package for improved thermal performance and reduced parasitic inductance

Overview

Infineon’s high voltage TOLT package with positive stand-off enables maximal system power density at lowest possible cost at scale. It reduces the parasitic inductance associated with long leaded packages such as the TO-247 package, and allows 95% of direct heat disipation. It has the same height as Q-DPAK to enable flat heatsink design.

Key Features

  • SMD top-side cooled package
  • Compact 10 x 15 mm footprint
  • Mold body thikness 2.30 mm
  • Lead pitch 2 mm
  • Tj,max 175°C
  • Reflow assembly
  • Creepage distance of 3.2 mm
  • Rthja (Ta: 85°C) ~4.4 K/W
  • Low parsitic inductance
  • Cooling area of 50 mm²
  • Positive-stand-off

Products

Design Resources Component

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