High voltage TOLT

High-voltage top-side cooled package for improved thermal performance and reduced parasitic inductance

Overview

Infineon’s high voltage TOLT package with positive stand-off enables maximal system power density at lowest possible cost at scale. It reduces the parasitic inductance associated with long leaded packages such as the TO-247 package, and allows 95% of direct heat disipation. It has the same height as Q-DPAK to enable flat heatsink design.

Key Features

  • SMD top-side cooled package
  • Compact 10 x 15 mm footprint
  • Mold body thickness 2.30 mm
  • Lead pitch 2 mm
  • Tj,max 175°C
  • Reflow assembly
  • Creepage distance of 3.2 mm
  • Rthja (Ta: 85°C) ~4.4 K/W
  • Low parsitic inductance
  • Cooling area of 50 mm²
  • Positive-stand-off

Products

About

Benefits of TOLT

The TOLT is the most price competitive package in our industrial Top Side Cooled product family, while it offers the same benefits as Q-DPAK such as 95% of direct heat dissipation, and cutting the parasitics inductance with 66%. It utilizes both CoolMOS™ and CoolSiC™ technologies better making it ideal selection for high density application with limited budget. It is ready to support liquid cooling design.

High power density designs with high current rating

The innovative TOLT package combined with the key features of CoolMOS™ and CoolSiC™ MOSFET technologies enables best-in-class products. The family is available with the latest CoolMOS™ 8 or CoolSiC™ G2 MOSFET technologies. The portfolio includes MOSFETs in 600 V and 650 V and feature high-current rating for high power density designs.

Top cooling enables advanced thermal performance with less power loss

The TOLT package is constructed with its lead frame flipped to position exposed metal on the top side; the package contains multiple gullwing leads on each side for drain and source connections that carry high current. In addition, the exposed pad is tin-free.

With a flipped lead frame, heat passes from the exposed metal top side directly to the heatsink through the insulating material. In the case of a bottom-side cooling package like TOLL, the heat is dissipated via the PCB to the heatsink, and power losses occur due to PCB thermal resistance. The new TOLT package achieves better RthJA, and improved RthJC.

Benefits of TOLT

The TOLT is the most price competitive package in our industrial Top Side Cooled product family, while it offers the same benefits as Q-DPAK such as 95% of direct heat dissipation, and cutting the parasitics inductance with 66%. It utilizes both CoolMOS™ and CoolSiC™ technologies better making it ideal selection for high density application with limited budget. It is ready to support liquid cooling design.

High power density designs with high current rating

The innovative TOLT package combined with the key features of CoolMOS™ and CoolSiC™ MOSFET technologies enables best-in-class products. The family is available with the latest CoolMOS™ 8 or CoolSiC™ G2 MOSFET technologies. The portfolio includes MOSFETs in 600 V and 650 V and feature high-current rating for high power density designs.

Top cooling enables advanced thermal performance with less power loss

The TOLT package is constructed with its lead frame flipped to position exposed metal on the top side; the package contains multiple gullwing leads on each side for drain and source connections that carry high current. In addition, the exposed pad is tin-free.

With a flipped lead frame, heat passes from the exposed metal top side directly to the heatsink through the insulating material. In the case of a bottom-side cooling package like TOLL, the heat is dissipated via the PCB to the heatsink, and power losses occur due to PCB thermal resistance. The new TOLT package achieves better RthJA, and improved RthJC.

Documents
Design Resources Component

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