Active and preferred
RoHS Compliant
Lead-free

IM69D128S

Ultra-low power digital XENSIV™ MEMS microphone
Data Sheet
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IM69D128S
IM69D128S
Data Sheet

Product details

  • AEC-Q103-003 qualified
    on demand
  • AOP
    128 dBSPL
  • Current Consumption
    520 µA
  • Green
    RoHS compliant, Halogen free
  • Interfaces
    Digital PDM
  • Package dimensions
    3.50 x 2.65 x 1.00 mm³
  • Sensitivity
    -37 dBFS
  • SNR
    69 dB(A)
  • Supply Voltage
    1.62 - 3.60 V
Recommended
OPN
IM69D128SV01XTMA1
Product Status active and preferred
Infineon Package
PG-TLGA-5-2
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TLGA-5-2
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The IM69D128S is an ultra-low power digital XENSIV™ MEMS microphone, with current consumption as low as 520 μA. Enabled by revolutionary digital microphone ASIC, IM69D128S masters the art of switching between different power & performance profiles without any audible artifacts. The Sealed Dual Membrane MEMS technology provides high IP57 ingress protection at a microphone level.

Features

  • Very low self-noise / high SNR of 69dB(A)
  • Ultra-low current consumption: 520 μA  in high performance profile; 420 μA in power saving profile; 180 μA in low power mode
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Very high dynamic range and acoustic overload point (AOP) of 128dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with an LFRO (low frequency roll-off) of 30Hz
  • Small package size of 3.5*2.65*0.98 mm

Benefits

  • Substantial battery saving without compromising on acoustic performance
  • Crystal clear audio signals even for highest sound pressure levels
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)
  • PCB area savings for space-critical applications

Documents

Documents

Design resources

Partner solutions

Developer community

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