Active and preferred
RoHS Compliant

CYW55571

Wi-Fi 6E tri-band Wi-Fi and Bluetooth® 5.3 SoC
Data Sheet
package
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CYW55571
CYW55571
Data Sheet

Product details

  • Antenna Configuration
    1x1
  • Bluetooth Interface
    UART/PCM/I2S
  • Bluetooth Specification
    Bluetooth 6.0
  • Core
    Cortex M33
  • CPU
    N/A
  • Dimensions
    12 x 12 mm, 5.3 x 5.7 mm, 5.32 x 5.67 mm
  • Family
    AIROC™ Wi-Fi + Bluetooth® Combos
  • GPIOs
    15
  • Launch Date
    2023
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Memory
    N/A
  • Operating system support
    Linux, Android
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V to 4.8 V
  • Package
    WLCSP-486, WLBGA-225, FCFBGA-289
  • Partner Module
    Y
  • Pitch
    0.2 mm, 0.35 mm, 0.65 mm
  • Planned to be available until at least
    01-01-2038
  • Product Description
    Wi-Fi 6 Combo
  • ROM
    2000 KB
  • SRAM
    512 kByte
  • Wi-Fi Band
    2.4GHz, 5GHz, 6GHz
  • Wi-Fi Bandwidth
    40 MHz
  • WI-FI Interface
    SDIO/PCIe
  • Wi-Fi Specification
    Wi-Fi 6E (802.11.ax)
Recommended
OPN
CYW55571MIFFBGT CYW55571MIWBGT CYW55571MIUBGT
Product Status active and preferred active and preferred active and preferred
Infineon Package
PG-TF2BGA-289
SG-XFWLB-486 SG-UFWLB-225
Package Name FCFBGA-289 (002-29083) WLCSP-486 (002-29726) WLBGA-225 (002-36128)
Packing Size 1500 5000 5000
Packing Type TAPE & REEL TAPE & REEL TAPE & REEL
Moisture Level 3 1 1
Moisture Packing DRY NON DRY NON DRY
Lead-free No No Yes
Halogen Free No No Yes
RoHS Compliant Yes Yes Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TF2BGA-289
Package Name FCFBGA-289 (002-29083)
Packing Size 1500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package SG-XFWLB-486
Package Name WLCSP-486 (002-29726)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package SG-UFWLB-225
Package Name WLBGA-225 (002-36128)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The AIROC™ CYW55571 is Infineon's highest-performing tri-band Wi-Fi 6/6E (2.4G, 5G, 6G) 1x1 80 MHz SISO solution. It features improved range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers high performance in congested network environments and significantly reduces latency by operating in the 6G spectrum.

Features

  • Wi-Fi 6/6E, Tri-band, 2x2 MIMO
  • 20/40/80 MHz, up to 600 Mbps PHY rate
  • OFDMA, MU-MIMO, TWT,DCM
  • Multi-layer security protection
  • Smart coexistence
  • Bluetooth® 5.3, Dual-mode operation
  • Bluetooth transmit at 20dbm/13dbm/0 dbm
  • WLAN: PCIe, SDIO, BT: UART, I2S, PCM
  • Temperature: -40°C to 85°C

Benefits

  • Performance beyond Wi-Fi 6/6e
  • Maximizes network efficiency
  • Extended edge AI+IoT device capabilities
  • High quality Bluetooth® LE audio
  • Multi-layer security protection
  • Accelerates time to market
  • Reduces development costs

Diagrams

CYW55571-Block-Diagram
CYW55571-Block-Diagram
CYW55571-Block-Diagram CYW55571-Block-Diagram CYW55571-Block-Diagram
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Documents

Documents

Design resources

Partner solutions

Developer community

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