not for new design
RoHS Compliant

CYW20819

Data Sheet
package
board
Multiple OPNs available
ea.

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CYW20819
CYW20819
ea.
Data Sheet

Product details

  • Bluetooth Classic
    Yes
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    -94.5 dBm
  • Bluetooth LE RX SENSITIVITY
    -95 dBm
  • Bluetooth LE TX POWER
    4.5 dBm
  • Bluetooth LE
    Yes
  • Bluetooth Specification
    5.4
  • CPU Frequency
    96 MHz
  • CPU
    Arm® Cortex®- M4
  • Family
    AIROC™ Bluetooth LE & Bluetooth
  • Flash
    256 kByte
  • GPIOs
    22
  • Launch Date
    31-03-2018
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating Temperature
    -30 °C to 85 °C
  • Operating Voltage
    1.71 V to 3.3 V
  • Partner Module
    N
  • Planned to be available until at least
    31-03-2033
  • RAM
    176 kByte
  • ROM
    1024 kByte
  • Software Support
    ModusToolbox™
OPN
CYW20819A1KFBG CYW20819A1KFBGT
Product Status not for new design not for new design
Infineon Package
PG-VFBGA-62
PG-VFBGA-62
Package Name FBGA-62 (002-20916) FBGA-62 (002-20916)
Packing Size 2450 5000
Packing Type TRAY TAPE & REEL
Moisture Level 3 3
Moisture Packing DRY DRY
Lead-free No No
Halogen Free No No
RoHS Compliant Yes Yes
Infineon stock last updated:
 ea. in stock ea. in stock

Product Status not for new design
Infineon Package
PG-VFBGA-62
Package Name FBGA-62 (002-20916)
Packing Size 2450
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status not for new design
Infineon Package
PG-VFBGA-62
Package Name FBGA-62 (002-20916)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 Core compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20819 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.

Features

  • Onboard crystal oscillator
  • Passive components
  • Flash memory
  • Arm® Cortex®-M4 core
  • Bluetooth® stack in ROM
  • 256-KB on-chip flash
  • 176-KB on-chip RAM
  • True Random Number Generator (TRNG)
  • AES-128
  • ECDSA signature verification
  • Security functions in ROM
  • Over-the-air (OTA) firmware updates

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications
  • Low power
  • Low cost

Documents

Documents

Design resources

Partner solutions

Developer community

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