CYW20706
Active
RoHS Compliant
Lead-free

CYW20706

Datasheet
package
board
software
Multiple OPNs available
ea.

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CYW20706
CYW20706
Datasheet


Product details

  • Bluetooth Classic
    Yes
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    -95.5 dBm
  • Bluetooth LE RX SENSITIVITY
    -96.5 dBm
  • Bluetooth LE TX POWER
    9 dBm
  • Bluetooth LE
    Yes
  • Bluetooth Specification
    5.4
  • CPU Frequency
    48 MHz
  • CPU
    Arm® Cortex®- M3
  • Family
    AIROC™ Bluetooth LE & Bluetooth
  • GPIOs
    24
  • Launch Date
    2025
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating Temperature range
    -30 °C to 85 °C
  • Operating Voltage range
    1.62 V to 3.6 V, 2.25 V to 2.94 V
  • Partner Module
    Y
  • Planned to be available until at least
    31-12-2030
  • RAM
    352 KByte
  • ROM
    848 kByte
  • Software Support
    ModusToolbox™

Recommended
OPN
CYW20706UA2KFFB4G CYW20706UA2KFFB4GT
Product Status active active
Infineon Package
PG-VF2BGA-49
PG-VF2BGA-49
Package Name FCBGA-49 (002-13601) FCBGA-49 (002-13601)
Packing Size 4900 2500
Packing Type TRAY TAPE & REEL
Moisture Level 3 3
Moisture Packing DRY DRY
Lead-free Yes Yes
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Country of Assembly (CoA)
TH
TH
Country of Diffusion (CoD)
SG,TW
SG,TW
Infineon stock last updated:
 ea. in stock
ea. in stock

Product Status
Active
Infineon Package
PG-VF2BGA-49
Package Name FCBGA-49 (002-13601)
Packing Size 4900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
TH
Country of Diffusion (CoD)
SG,TW

Product Status
Active
Infineon Package
PG-VF2BGA-49
Package Name FCBGA-49 (002-13601)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
TH
Country of Diffusion (CoD)
SG,TW
The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20706 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.

Features

  • Arm® Cortex®-M3 32-bit RISC processor
  • Embedded ICE-RT debug
  • SWD interface units
  • 352-KB on-chip RAM
  • Bluetooth® core specification 5.2
  • Integrated low dropout regulators (LDO)
  • LE data rate up to 2 Mbps
  • Up to 24 GPIOs
  • I²C, I²S, UART, and PCM interfaces

Benefits

  • Support for BR, EDR, and Bluetooth® LE
  • Support for EEPROM and serial flash

Diagrams

CYW20706 Block Diagram
CYW20706 Block Diagram
CYW20706 Block Diagram
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Documents

Design resources

Partner solutions

Developer community