Active and preferred
RoHS Compliant
Lead-free

CY7C1370KV33-200BZXI

Data Sheet
package
ea.
in stock

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CY7C1370KV33-200BZXI
CY7C1370KV33-200BZXI
ea.
Data Sheet

Product details

  • Architecture
    NoBL, Pipeline
  • Bank Switching
    N
  • Burst Length (Words)
    4
  • Data Width
    x 36
  • Density
    18 MBit
  • ECC
    N
  • Family
    NoBL
  • Frequency
    167 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Ag/Cu
  • On-Die Termination
    N
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3.135 V to 3.6 V
  • Organization (X x Y)
    512Kb x 36
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2031
  • Qualification
    Industrial
  • Read Latency (Cycles)
    2
Recommended
OPN
CY7C1370KV33-200BZXI
Product Status active and preferred
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 136
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 136
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

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