Active and preferred
RoHS Compliant
Lead-free

BGS12P2L6

Data Sheet
package
ea.
in stock

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BGS12P2L6
BGS12P2L6
ea.
Data Sheet

Product details

  • Control Interface
    GPIO
  • Frequency Range
    0.05 - 6.0 GHz
  • Insertion Loss (@1GHz)
    0.25 dB
  • Isolation (@1GHz)
    45 dB
  • Pmax max
    38 dBm
  • Supply Voltage
    1.65 - 3.4 V
  • Switch Type
    SPDT
Recommended
OPN
BGS12P2L6E6327XTSA1
Product Status active and preferred
Infineon Package
TSLP-6-4
Package Name N/A
Packing Size 15000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
TSLP-6-4
Package Name -
Packing Size 15000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The BGS12P2L6 is a general purpose high power SPDT switch, designed to cover a broad range applications from 0.05 to 6 GHz and therefore excellent for 5G sub-6 GHz. Its outstanding RF performance optimizes the transmitting path (TRx) of LTE/5G mobile phones. The chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. The BGS12P2L6 RF switch is manufactured in Infineon’s patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. The device has a very small size of only 0.7 x 1.1 mm2 and a maximum height of 0.31 mm.

Features

  • RF CMOS SPDT RF switch with power handling capability of up to 37 dBm
  • Suitable for multi-mode LTE and 5G applications
  • Low insertion loss and harmonics generation
  • 0.05 to 6 GHz coverage
  • High port-to-port isolation
  • No blocking capacitors required if no DC applied on RF lines
  • On-chip control logic
  • Leadless and halogen free package TSLP-6-4
  • Size: 0.7 x 1.1 mm2 and thickness of 0.31 mm
  • No power supply decoupling required
  • High EMI robustness
  • RoHS and WEEE compliant package

Documents

Documents

Design resources

Partner solutions

Developer community

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