PG-TSOP6-6-5

Package details

  • Package Material
    PG
  • Package Family
    PG-TSOP6
  • Terminals
    6
  • Variant
    5
  • Exposed Paddle
    No
  • Body Length (mm)
    2.9
  • Body Width (mm)
    1.6
  • Min. Terminal Pitch (mm)
    0.95
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    10000
    1
    330
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    3000
    1
    180
Infineon small outline packages (SOP) are offered as various families. They are available as shrink (S), thin (T), and thin shrink (TS) versions. Alternative and legacy designations may include TSOP-I and TSOP-II as well as MICRO8 (MO-187). The lead frame based packages offer diverse configurations when it comes to die pads and heat slugs. The dual row gullwing shaped leads allow for high-throughput board mounting using surface mount technology (SMT). The lead construction causes a stand-off distance between the gullwing foot landing area and the exposed die pad plane which has to be considered during board mount design. Typical products are linear voltage regulators, switches, transceivers, gate driver ICs, motor drivers, controllers, and more.

Image Gallery

PG-TSOP6-6-5_Package Outline
PG-TSOP6-6-5_Package Outline
PG-TSOP6-6-5_Package Outline PG-TSOP6-6-5_Package Outline PG-TSOP6-6-5_Package Outline
PG-TSOP6-6-5_Footprint Drawing PG-TSOP6-6-5_Footprint Drawing PG-TSOP6-6-5_Footprint Drawing
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Documents and drawings

Documents and drawings