PG-HDSOP-22-2

Package details

  • Package Material
    PG
  • Package Family
    PG-HDSOP
  • Terminals
    22
  • Variant
    2
  • Exposed Paddle
    Yes
  • Body Length (mm)
    15.0
  • Body Width (mm)
    15.4
  • Min. Terminal Pitch (mm)
    1.14
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    750
    1
    330
Infineon heat spreader dual small outline packages (HDSOP) are offered as different variants. Alternative designation examples are double discrete package (DDPAK) for HDSOP-10, quadruple discrete package (QDPAK) for HDSOP-22 or transistor outline leadless top-side cooling package (TOLT) for HDSOP-16. Versions with bottom-side cooling (BSC) and top-side cooling (TSC) are available depending on the product. The top-side heat-slug allows to decouple the thermal drain from the mounting board performance. The dual row gullwing shaped leads allow for high-throughput board mounting using surface mount technology (SMT). The lead construction causes a stand-off distance between the gullwing foot landing area and the exposed die pad plane which has to be considered during board mount design. Typical products are linear voltage regulators, controllers, power switches, full-bridge ICs, drivers, and more.

Image Gallery

PG-HDSOP-22-2_PNG
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PG-HDSOP-22-2_PNG PG-HDSOP-22-2_PNG PG-HDSOP-22-2_PNG
PG-HDSOP-22-2_PNG PG-HDSOP-22-2_PNG PG-HDSOP-22-2_PNG
PG-HDSOP-22-2_Package Outline PG-HDSOP-22-2_Package Outline PG-HDSOP-22-2_Package Outline
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Documents and drawings

Documents and drawings