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TLx4971 / TLE4973 solder and PCB recommendation and thermal guideline for TISON-8

The printed circuit board (PCB) layout and soldering are important recommendations for the sensor to achieve better thermal and accuracy performance. In order to have less resistance due to solder joints, this document gives a recommendation for the stencil and refers the Infineon assembly recommendation for PG-TISON-8 packages [1]. The following key aspects been discussed: • Assembling instructions of the sensor on a reference PCB • Stray field cancellation • TISON-8 package • Reference PCB dimensions and the layer stack up recommendations. • Thermal management of the sensor for the following PCBs − For reference PCB − For electric drive system. Please be aware this document was initiated with the TLI4971 in 2019. Meanwhile TLE4971 and TLE4973 joined the product family. The design of the current rail is the same in all three devices and so TLI4971 is left in the document as a place-holder for TISON-8 package.

• 1.44 MB
• Nov 29, 2022