Active and preferred
RoHS Compliant

CYW955913EVK-01

AIROC™ CYW55913 1x1 Wi-Fi 6E and Bluetooth® Low Energy 5.4 connected MCU Evaluation Kit (CYW955913EVK-01)
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in stock

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CYW955913EVK-01
CYW955913EVK-01
ea.

Product details

Recommended
OPN
CYW955913EVK-01
Product Status active and preferred
Infineon Package N/A
Package Name N/A
Packing Size 1
Packing Type CONTAINER
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package N/A
Package Name -
Packing Size 1
Packing Type CONTAINER
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The Infineon AIROC™ CYW55913 Wi-Fi and Bluetooth® Low Energy (LE) connected MCU Evaluation Kit (CYW955913EVK-01) enables the evaluation, prototyping, and development of CYW55913/CYW55912/CYW55911 for a wide array of applications for the Internet of Things.

Features

  • 192 MHz Arm® Cortex®-M33 and Trustzone
  • QSPI/SMIF for FLASH/PSRAM with XIP, OTF
  • SDIO/SPI/UART/I2C/I2S/PDM/GPIOs/TCPWM
  • 12b 7ch ADC
  • 1x1 Wi-Fi 6E (2.4/5/6GHz) 20MHz
  • Integrated PA up to +24dBm Tx power
  • WPA 3 Security
  • Matter over Wi-Fi
  • Bluetooth® Low Energy 5.4 features
  • LE Long Range, LE 2Mbps, Adv. Ext.
  • +4/+13/+19 BLE Power Amplifiers
  • -111.5dBm LE Long-Range Sensitivity

Benefits

  • Embedded or Host Offload operation
  • Best in class Wi-Fi and BLE range
  • Ultra-low-power Wi-Fi and BLE MCU
  • Up to 47 GPIOs enable many peripherals
  • Multi-Layer Security
  • AT Command Set

Bill of Material

Documents

Documents

Design resources

Partner solutions