Active and preferred
RoHS Compliant
Lead-free

CYW20829B0-P4EPI100

Data Sheet
package
board

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

CYW20829B0-P4EPI100
CYW20829B0-P4EPI100
Data Sheet

Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SD(1, 12bit ENoB (audio), 11 bit ENoB (DC), 12MHz Clock
  • Base Silicon
    CYW20829
  • Bluetooth Classic
    No
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    N/A
  • Bluetooth EDR 2Mbps TX POWER
    N/A
  • Bluetooth LE Data rate
    2 MByte/s
  • Bluetooth LE RX SENSITIVITY
    –106.0 dBm
  • Bluetooth LE TX POWER
    10 dBm
  • Bluetooth LE
    Yes
  • CapSense
    No
  • CPU Core
    96MHz
  • Extended Range
    Yes
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    1024 kByte
  • GPIOs
    26
  • I2C
    2
  • Launch Date
    31-03-2024
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®-M33
  • Operating Temperature range
    -40 °C to 85 °C
  • Pads
    41
  • PDM
    2
  • Planned to be available until at least
    31-03-2039
  • PWM
    7
  • ROM
    64
  • Secondary CPU Core
    Arm® Cortex®-M33
  • Serial Communication Blocks
    3
  • Size (X mm x Y mm x Z mm)
    14.5 x 19 x 1.95 mm
  • SPI
    2
  • SRAM
    256 kByte
  • Type of Antenna
    External - RF pad
  • UART
    2
  • V range
    2.75 V to 3.6 V
Recommended
OPN
CYW20829B0P4EPI100XUMA1
Product Status active and preferred
Infineon Package
LG-MLGA-42
Package Name MODULE-42 (002-28053)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
LG-MLGA-42
Package Name MODULE-42 (002-28053)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The CYW20829B0-P4EPI100 is a fully integrated Bluetooth® LE wireless module. The CYW20829B0-P4EPI100 includes an onboard crystal oscillator, passive components, flash memory, and the CYW20829 - the Bluetooth® LE 5.4 MCU with Industry’s best range, ARM® Cortex® -M33 dedicated for applications and CAN FD. The CYW20829B0-P4EPI100 supports an external antenna through an RF solder pad output.

Features

  • Bluetooth® LE 5.4 MCU
  • 96 MHz ARM® Cortex® -M33
  • 1024 KB SFlash / 256 KB SRAM
  • TX Power: up to +10 dBm
  • Robust Receive sensitivity of -106 dBm
  • Fully qualified by Bluetooth® SIG
  • FCC, ISED, CE, MIC
  • 26 Programmable GPIO
  • 14.5 x 19 x 1.95 mm
  • External antenna via an RF solder pad
  • Up to 85°C operating temperature

Benefits

  • Industry’s best range and noise immunity
  • Proof your designs with Bluetooth®LE 5.4
  • Reduce RF design effort with module
  • Fast-to-market with certified module

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }