The solution of choice for multi-application cards
The SLC 32P platform is designed to reduce complexity and conserve resources while giving our customers a head-start on current market trends. It reduces development effort by accelerating design, approval and lead time cycles.
Leading security performance
The SLC 32P family’s proven security concept builds on a high-speed coprocessor supporting both symmetrical cryptography (with AES and DES) and asymmetrical cryptography (with certified RSA and ECC libraries). Chip security is further enhanced by the AIS 31-compliant Hybrid Random Number Generator, which uses a physical noise source and features built-in cryptographic post-proce
Single platform spanning all payment requirements and applications
This security microcontroller family is unique in the market as it covers the entire contactbased, dual-interface and contactless application spectrum for online and offline data authentication (dynamic/combined data authentication; DDA/CDA).
The Infineon platform SLC 32P allows integration of all functions with only one OS solution.
Further highlights include:
- A powerful 16-bit core
- State-of-the-art 65nm technology
- A common footprint to maximize synergies
- SOLID FLASH™ for record time-to-market
- Innovative Coil on Module technology featuring inductive coupling
Committed to open standards
The SLC 32P meets the rising performance demands of today’s contactless applications and supports all contactless transmission protocols, including the open CIPURSE™ standard for secured, cost-effective handling of payment and transport applications. The CIPURSE™ standard is non-proprietary, interoperable and capable of supporting multi-functional cards and infrastructure convergence.
SLC 32P is furthermore the ideal platform for EMV migrations, for instance, especially where outstanding contactless performance is required. The combination of SOLID FLASH™ and contactless technology makes it a perfect match for Java-based implementations.
CIPURSE™ is a trademark of the OSPT Alliance
Fastest time to market with Infineon’s SOLID FLASH™ technology
SLC 32P features Infineon’s SOLID FLASH™ technology. This future-proof memory concept meets growing demand for increasingly differentiated types and levels of functionality in smart cards. It combines the advantages of flexible non-volatile memory (NVM) with a sophisticated security concept. Compared with ROM-based solutions, this smart design accelerates time-to-market by more than 50%. Furthermore, it significantly reduces planning and logistics complexity.
Easy transition from contact-based to contactlesswith Infineon’s innovative Coil on Module technology
Infineon’s Coil on Module (CoM) technology features inductive coupling to give card manufacturers rapid access to the growing market for contactless solutions without having to make heavy investments in new manufacturing equipment.
Instead of a physical link between the module and the antenna, CoM uses radio frequency, which improves the performance, robustness and reliability of the final product.
Find an answer to your question
Technical Assistance Center (TAC)
Infineon welcomes your comments and questions.
If you have any questions concerning our products, please fill out the following form. Your inquiry will be sent to the appropriate specialist who will be in touch with you as soon as possible.
You will receive a confirmation E-mail to validate your address in our system. Any attached file to the reply which will help to support your inquiry is highly appreciated.