EconoPACK™ 2 & 3

Overview

Our high performance and flexible solution that fulfills high power density needs

Our general purpose modules for applications like industrial drives, commercial air conditions or ancillary inverters for wind mills or commercial and agricultural vehicles.

Products
Highlights

EconoPACK™ with Shunts

More than you expect.

EconoPACK™ 2 & 3 modules are also available with integrated current measurement shunts to enable system cost savings.

Key Features

  • Shunt resistors for current measurement are placed directly on the heat sink
  • Optimized heat spread guarantees effective thermal management
  • Equal thermal voltage over all resistors inside the module improves accuracy of current measurement
  • Save space on PCB
  • Less thermal stress on PCB

Overview EconoPACK™ 2 & 3 with shunts

Details

Related information about other products in this family

Key Features Main Application
  • Integration: On-board temperature and current measurement via NTC and shunt*, pre-applied Thermal Interface Material (TIM*), for lower handling costs
  • Flexibility: Customizable package (pin position and topology can be adapted to customer needs)
  • One fits all: Numerous topologies, voltages (600 V-1700 V) and currents (15 A-200 A) serve several application for platform strategies
    Power Density: Trenchstop™ IGBT4 technology with Tvjop = 150°C for higher power density compared to Trenchstop™ IGBT3 for compact inverter designs
  • Performance: Pre-applied TIM allows increased output power compared to standard module + longer lifetime
  • Standardization: Established RoHS-compliant housing concept for high availability
  • Simplicity: PressFIT for main as well as auxiliary terminals to reduce mounting effort

Overview EconoPACK™ 2 & 3

Topologies

This might also interest you

Recommended Documents

Tools & Software
Videos

PressFIT Technology

3:00

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material

3:03

A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

Support

Find an answer to your question

Technical Assistance Center (TAC)

Infineon welcomes your comments and questions.

If you have any questions concerning our products, please fill out the following form. Your inquiry will be sent to the appropriate specialist who will be in touch with you as soon as possible.

You will receive a confirmation E-mail to validate your address in our system. Any attached file to the reply which will help to support your inquiry is highly appreciated.

All fields marked with an asterisk (*) are mandatory.

Support forum