Overview

EconoPACK™ IGBT modules are our general-purpose modules for applications like industrial drives, commercial heating, ventilation, and air conditioning, auxiliary inverters for wind turbines, or CAV. The EconoPACK™ modules come in half-bridge, four-pack, or six-pack configurations and can thus be used in a wide range of inverter designs.

Key features
  • For wide inverter design ranges
  • Copper base plate
  • Includes a thermistor (NTC)
  • Solder or PressFIT pins
  • With optional pre-applied TIM
Applications
Motor Control
Online UPS
Photovoltaic
Heating ventilation and air conditioning (HVAC)

Products

About

Introduction to EconoPACK™ 2 and 3 modules

The Econo housing features a copper base plate for optimized heat spread and includes a thermistor (NTC). Econo modules are available with solder or PressFIT pins and an increasing number of Econo modules are available with pre-applied thermal interface material (TIM) already. Selected EconoPACK™ modules feature integrated shunts for accurate and cost-efficient current sensing.

EconoPACK™ integrates various chip technologies that allow to cover a wide range of application requirements, starting from NPT to TRENCHSTOP™ in 650 V/1200 V/1700 V.

EconoPACK™ with TRENCHSTOP™ IGBT7

EconoPACK™ 2 and 3 modules are also available with the latest TRENCHSTOP™ IGBT7 chip generation for a better product lifetime while keeping the operating conditions unchanged. Benefits of IGBT7 are that the VCEsat is reduced by 20% compared to IGBT4 while keeping the turn-off losses at the same level, it is optimized for drive applications with a Tvjop under overload up to 175°C, and a high power density (e.g., FS150R12N2T7) that can reach up to 37 kW in heavy duty.

More about TRENCHSTOP IGBT7
Key features

EconoPACK™ 2 and 3 modules are equipped with NTCs and shunts for a reliable on-board temperature and current measurement. The customizable package enables high flexibility (pin position can be adapted to customer needs) while the well-established RoHS-compliant housing concept ensures high availability. A broad spectrum of voltage and current variants (from 600 to 1700 V and 15 to 200 A) serve several application and platform strategies. PressFIT for main as well as auxiliary terminals reduces the mounting effort. Many variants are also available with pre-applied thermal interface material (TIM) allowing an increased output power, a longer lifetime, and lower handling costs.

Introduction to EconoPACK™ 2 and 3 modules

The Econo housing features a copper base plate for optimized heat spread and includes a thermistor (NTC). Econo modules are available with solder or PressFIT pins and an increasing number of Econo modules are available with pre-applied thermal interface material (TIM) already. Selected EconoPACK™ modules feature integrated shunts for accurate and cost-efficient current sensing.

EconoPACK™ integrates various chip technologies that allow to cover a wide range of application requirements, starting from NPT to TRENCHSTOP™ in 650 V/1200 V/1700 V.

EconoPACK™ with TRENCHSTOP™ IGBT7

EconoPACK™ 2 and 3 modules are also available with the latest TRENCHSTOP™ IGBT7 chip generation for a better product lifetime while keeping the operating conditions unchanged. Benefits of IGBT7 are that the VCEsat is reduced by 20% compared to IGBT4 while keeping the turn-off losses at the same level, it is optimized for drive applications with a Tvjop under overload up to 175°C, and a high power density (e.g., FS150R12N2T7) that can reach up to 37 kW in heavy duty.

More about TRENCHSTOP IGBT7

Key features

EconoPACK™ 2 and 3 modules are equipped with NTCs and shunts for a reliable on-board temperature and current measurement. The customizable package enables high flexibility (pin position can be adapted to customer needs) while the well-established RoHS-compliant housing concept ensures high availability. A broad spectrum of voltage and current variants (from 600 to 1700 V and 15 to 200 A) serve several application and platform strategies. PressFIT for main as well as auxiliary terminals reduces the mounting effort. Many variants are also available with pre-applied thermal interface material (TIM) allowing an increased output power, a longer lifetime, and lower handling costs.

Documents

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