Secure and powerful semiconductors capable of withstanding high electrical and thermal stress
As the market evolves towards connectivity, new security issues arise for induction cooking technology. Higher power stoves for faster cooking also mean that components are expected to operate under more demanding conditions.
At Infineon, we are well equipped to help you overcome all the challenges common to induction cooking appliances. Quicker, more consistent heating and better energy-efficiency have made induction cooking a growing consumer trend. But designing an induction cooking system is not without its challenges. Designers often face the problem of high field failure rates caused by grid disturbances, and the replacement and service costs for stoves are very high. On the other hand, the competitive nature of the market increases cost pressure and limits the use of protective features.
Induction cooking system diagram
In our full-spectrum portfolio of IGBT, you can find cost-optimized solutions engineered for high performance, such as the RC-H5 IGBT family. Our products also operate under high EMC disturbances and surge conditions, and enable high power operation with a high system-efficiency due to low VCEsat, VF, Eoff, and Rth.
Our EICEDriver™ compact gate driver family guarantees high immunity against negative voltage undershoots and low dissipation.
You can exploit the wide functionalities of our XMC family of MCUs for a simple design of the system control. Choose products and expertise from Infineon and easily design your induction cooking applications to fulfill the latest market demands.
- IGBT power semiconductors in discrete packages
- EICEDriver™ Gate Driver ICs
- Digital Motor Controller (iMOTION™)
- CoolSET™ products for auxiliary power supplies
- WICED® connectivity products for WiFi/BLE integration
- PSoC® 6 / XMC™ microcontrollers
- OPTIGA™ Trust product family for embedded security solutions
- XENSIV™ family of magnetic sensors
PSoC® 6 bridges the gap between expensive, power-hungry application processors and low‑performance microcontrollers (MCUs). The ultra‑low‑power PSoC® 6 MCU features an Arm® Cortex®‑M4 for high‑performance tasks and an Arm® Cortex®‑M0+ for low-power tasks, and with security built-in, your IoT system is protected.
Cypress' WICED® Wi-Fi® + Bluetooth® combos integrate IEEE 802.11a/b/g/n/ac WLAN and Bluetooth in a single-chip solution to enable small-form-factor IoT designs. Combo solutions are available for both 1x1 SISO with up to 433 Mbps PHY data rates and 2x2 MIMO with up to 867 Mbps PHY data rates. These solutions can be coupled with external MCUs from popular vendors or Linux on applications processors to implement a complete Wi-Fi + Bluetooth system.
Infineon’s Discrete RC-IGBTs products designed for induction heating applications, in combination with PSoC® 6 / XMC™ microcontrollers for system control, WICED® connectivity products, and XENSIV™ sensors enable highly compact, robust, and reliable systems that consume less power and offer a rich user interface.
Responding to a growing focus on embedded systems amongst attackers, Infineon offers OPTIGA™ Trust hardware security solutions based on a high-end security controller optimized for connected devices. It provides extremely flexible, high-performance, secured access to any major cloud provider.
Predictive maintenance enables a data-driven approach to predict and prevent device failures based on pattern recognition and intelligent software models. To collect the necessary data and enable monitoring of the condition of devices in a building, smart XENSIV™ sensors help to record the most crucial parameters of a device’s status.
Whitepaper: Power device choices in the new small home appliance market
Dive deeper and discover more about the changing landscape of SHA market and enablement of electronic solutions in this free white paper.
Webinar: Motor control and power solutions for small home appliances
Learn about the wide range of Infineon solutions with a focus on iMOTION™ and Intelligent Power Modules (IPMs), and the advantages they provide in these applications.
Induction Heating: IGBT Presentation Part 1
Induction Heating: IGBT Presentation Part 2
Infineon’s 3rd. Generation Reverse Conduction IGBTs
RC-H5 The Next Generation Reverse Conduction IGBT Part 1 of 2
RC-H5 The Next Generation Reverse Conduction IGBT Part 2 of 2