Active and preferred
RoHS Compliant

S70KL1282DPBHI020

ea.
in stock

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S70KL1282DPBHI020
S70KL1282DPBHI020
ea.

Product details

  • Density
    128 MBit
  • Family
    KL-2
  • Initial Access Time
    36 ns
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    N/A
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    2.7 V to 3.6 V
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    See roadmap
  • Qualification
    Industrial
  • Technology
    HYPERRAM
OPN
S70KL1282DPBHI020
Product Status active and preferred
Infineon Package
Package Name BGA-24 (002-15550)
Packing Size 3380
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name BGA-24 (002-15550)
Packing Size 3380
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
S70KL1282DPBHI020 is a 128 Mb HYPERRAM™ self-refresh DRAM (PSRAM) with a HYPERBUS™ interface, 8-bit DDR data bus, and RWDS strobe (data strobe or write mask). It is a 3.0 V-only device operating at 2.7 V to 3.60 V, supports DP speed up to 166 MHz, and specifies 35 ns max access time. Configurable linear or wrapped bursts and standby, hybrid sleep, and deep power down modes are supported in a 24-ball FBGA.

Features

  • HYPERBUS interface
  • 1.7 V to 2.0 V VCC option
  • 2.7 V to 3.60 V VCC option
  • 8-bit DDR data bus (DQ[7:0])
  • 200 MHz maximum clock rate
  • Up to 400 MBps throughput
  • 35 ns maximum access time (tACC)
  • Wrapped bursts 16/32/64/128 B
  • RWDS strobe and write data mask
  • DCARS option shifts RWDS phase
  • Hybrid sleep retains data
  • Deep power down stops refresh

Benefits

  • High bandwidth with few pins
  • Fits 1.8 V or 3.0 V logic rails
  • DDR bus reduces system pin count
  • 200 MHz supports fast processors
  • 400 MBps feeds high-rate buffers
  • 35 ns tACC reduces read latency
  • Burst sizes match cache-line needs
  • RWDS eases DDR timing closure
  • DCARS improves read eye margin
  • Hybrid sleep cuts power, keeps data
  • DPD minimizes leakage when off
  • Clock-stop lowers stall current

Documents

Design resources

Developer community

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