Active and preferred
RoHS Compliant
Lead-free

S26HL512TFPBHB013

Data Sheet
package

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S26HL512TFPBHB013
S26HL512TFPBHB013
Data Sheet

Product details

  • Classification
    ISO 26262-compliant
  • Density
    512 MBit
  • Family
    HL-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 105 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Automotive
Recommended
OPN
S26HL512TFPBHB013
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S26HL512TFPBHB013 is a 512 Mb SEMPER™ NOR Flash device with HYPERBUS™ and SPI interfaces for DDR data transfer and JEDEC xSPI compatibility. Designed for automotive and industrial use, it operates from 2.7 V to 3.6 V and -40°C to 125°C (AEC-Q100 Grade 1). Embedded Hamming ECC ensures robust error correction, while Endurance Flex architecture enables up to 1+ million cycles or 25 years retention. Diagnostics and SafeBoot enhance reliability for demanding environments.

Features

  • 45-nm MIRRORBIT technology, 2 bits/cell
  • Configurable sector architecture:
  • 256/512-byte page programming buffer
  • OTP secure silicon region (SSR) 1024 bytes
  • HYPERBUS and legacy SPI interfaces
  • DDR up to 400 MBps, SDR up to 21 MBps
  • Embedded ECC: single-bit correction,
  • Interface and data integrity CRC
  • SafeBoot and AutoBoot features
  • Advanced sector protection
  • Endurance Flex: high endurance/long retention
  • JEDEC xSPI (JESD251) compatibility

Benefits

  • High density and reliability for demanding
  • Flexible memory mapping for design freedom
  • Fast programming speeds boost throughput
  • Secure storage for sensitive data
  • Easy integration with multiple host
  • High data rates enable rapid data access
  • Enhanced data integrity and error resilience
  • Communication errors detected and corrected
  • Fast, reliable boot and recovery
  • Fine-grained memory protection options
  • Customizable endurance for varied needs
  • Industry-standard compatibility for broad use

Documents

Documents

Design resources

Partner solutions

Developer community

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