S-MID4.8

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

S-MID4.8
S-MID4.8

Product details

  • Applications
    government identification, authentication
  • Contact Surface
    NiAu
  • Delivery Forms
    Tape on Reel
  • Derivatives
    Pd surface, Au surface
  • Dimensions
    13 x 11.8mm
  • ISO – Reference
    ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Pitch
    14.25 mm
  • Product Description
    contact-based module, for high demanding applications, 10 years life time
  • Product Name
    S-MID4.8
  • Thickness
    max. 420µm
OPN
Product Status
Infineon Package
Package Name
Packing Size
Packing Type
Moisture Level
Moisture Packing
Lead-free
Halogen Free
RoHS Compliant
Infineon stock last updated:
8 PIN contact based module

Features

  • dedicated for 10 years life time applications
  • reduced chip thickness giving new flexibility in card construction
  • Superior tape material for highest robustness
  • based on proven FlipChip-Technology

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }