P-MCS8-2-1
Active and preferred
RoHS Compliant

P-MCS8-2-1

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P-MCS8-2-1
P-MCS8-2-1


Product details

  • Applications
    payment, government identification
  • Contact Surface
    Ag
  • Delivery Forms
    Tape on Reel
  • Dimensions
    8.1 x 5.15mm
  • ISO – Reference
    ISO 7816-1, ISO 7810, ISO 10373-1/-3, ISO 14443
  • Pitch
    9.5 mm
  • Product Description
    thin contactless module, mold
  • Product Name
    P-MCS8-2-1
  • Thickness
    max. 250µm

Recommended
OPN
Product Status active and preferred active and preferred
Infineon Package P-MCS8-2 --
Package Name N/A N/A
Packing Size N/A N/A
Packing Type N/A N/A
Moisture Level N/A N/A
Moisture Packing N/A N/A
Lead-free No No
Halogen Free Yes Yes
RoHS Compliant Yes Yes

Product Status
Active
Infineon Package P-MCS8-2
Package Name -
Packing Size 0
Packing Type
Moisture Level -
Moisture Packing
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package --
Package Name -
Packing Size 0
Packing Type
Moisture Level -
Moisture Packing
Lead Free
Halogen Free
RoHS Compliant
The P-MCS8-2-1 is a economical thin module (< 250µm) allowing: integration of additional security layer, possibility of very thin inlays, additional layer to reduce card cracks, higher card quality (more coverage over chip). It uses the proven lead frame design from the P-MCC8-2-6. With its standard dimensions and due to its compatible design existing sets of production settings e.g. for thermo compression can be used and allow a easy change over.

Features

  • 9.5mm
  • 8.1 x 5.15mm
  • max. 250µm
  • Ag
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Tape on Reel

Applications

Documents

Design resources

Partner solutions

Developer community