Active and preferred
RoHS Compliant

IAUCN10S7N040

100 V, N-Ch, 4.0 mΩ max, Automotive MOSFET, SSO8 (5x6), OptiMOS™ 7
Data Sheet
package
ea.
in stock

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IAUCN10S7N040
IAUCN10S7N040
ea.
Data Sheet

Product details

  • ID (@25°C) max
    120 A
  • Launch year
    2024
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    Single SSO8
  • Currently planned availability until at least
    2038
  • Polarity
    N
  • QG (typ @10V)
    39.3 nC
  • Qualification
    Automotive
  • RDS (on) (@10V) max
    4 mΩ
  • Technology
    OptiMOS™-7
  • VDS max
    100 V
  • VGS(th)
    2.8 V
Recommended
OPN
IAUCN10S7N040ATMA1
Product Status active and preferred
Infineon Package
PG-TDSON-8
Package Name Single SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TDSON-8
Package Name Single SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
IAUCN10S7N040 is an automotive MOSFET built with Infineon’s leading edge, power semiconductor technology; OptiMOS™ 7 100 V. This product is offered in our versatile, robust, high current SSO8 5x6 mm2 SMD package. It is designed specifically for high performance, high quality and the robustness needed for demanding automotive applications.

Features

  • Low on-resistance, RDS(on)
  • Leading edge FOM (RDS(on)x Qg)
  • Fast switching times (turn on/off)
  • High avalanche current capability
  • High SOA ruggedness
  • Tight threshold voltage, VGS(th), range
  • Excellent thermal performance
  • Low package resistance and inductance
  • Unique fused source pins
  • Extended qualification beyond AEC-Q101
  • MSL1 up to 260°C peak reflow
  • PPAP Capable Device

Benefits

  • Very low conduction losses
  • Superior switching performance
  • Highest power density in 5x6 mm2 package
  • High power efficiency
  • Small footprint efficient cooling
  • Well suited for parallel placement
  • Increased design ruggedness
  • Better solder joint reliability
  • Designed for automotive robustness
  • High quality production for automotive
  • Enhanced electrical testing

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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