Active and preferred
RoHS Compliant
Lead-free

CYAT817AZS72-3BFBA

Automotive 1200V Silicon-carbide (SiC) Trench Power MOSFET in D2PAK-7L, 60mΩ
Data Sheet
package
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CYAT817AZS72-3BFBA
CYAT817AZS72-3BFBA
Data Sheet

Product details

  • Acoustic
    Yes
  • CAN
    No
  • CapSense
    Yes
  • CAPSENSE™ buttons
    Yes
  • CRYPTO
    Yes
  • Family
    TSG7_XL
  • Force Touch
    Yes
  • Gesture slider
    No
  • Gesture touchscreen
    Yes
  • H2O
    Yes
  • Haptics
    Yes
  • Hover
    Yes
  • Low-power wake-up button
    Yes
  • Number of fingers
    10
  • Number of sense pins
    72
  • Package
    100-pin TQFP
  • Proximity
    Yes
  • Secondary SCB (Touch data)
    Yes
  • Slider
    Yes
Recommended
OPN
CYAT817AZS72-3BFBA
Product Status active and preferred
Infineon Package
PG-TQFP-100
Package Name TQFP-100 (51-85048)
Packing Size 900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TQFP-100
Package Name TQFP-100 (51-85048)
Packing Size 900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
CYAT817AZS72-3BFBA is an Electronics Council (AEC) Q100 qualified Multi-touch Capacitive touchscreen controller part of the PSOC™ Automotive Multitouch Gen7XL. It comes in a PG-TQFP-100 package and supports screen sizes up to 15''. The touch controller provides a fast refresh rate up to 250Hz, supports water rejection, wet finger and thick gloves tracking. Ideal platform for HMI systems.

Features

  • Revolutionary semiconductor material - Silicon Carbide
  • Very low switching losses
  • Threshold-free on state characteristic
  • 0V turn-off gate voltage
  • Benchmark gate threshold voltage, VGS(th)=4.5V
  • Fully controllable dv/dt
  • Commutation robust body diode, ready for synchronous rectification
  • Temperature independent turn-off switching losses
  • Sense pin for optimized switching performance
  • Suitable for HV creepage requirements
  • XT interconnection technology for best-in-class thermal performance

Benefits

  • Efficiency improvement
  • Enabling higher frequency
  • Increased power density
  • Cooling effort reduction
  • Reduction of system complexity and cost

Documents

Documents

Design resources

Partner solutions

Developer community

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