Active and preferred

CY7C1470V25-200BZIT

Data Sheet
package

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CY7C1470V25-200BZIT
CY7C1470V25-200BZIT
Data Sheet

Product details

  • Architecture
    NoBL, Pipeline
  • Bank Switching
    N
  • Data Width
    x 36
  • Density
    72 MBit
  • ECC
    N
  • Family
    NoBL
  • Frequency
    200 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Pb
  • On-Die Termination
    N
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    2.38 V to 2.63 V
  • Organization (X x Y)
    2Mb x 36
  • Peak Reflow Temp
    220 °C
  • Qualification
    Industrial
  • Read Latency (Cycles)
    1
Recommended
OPN
CY7C1470V25-200BZIT
Product Status active and preferred
Infineon Package
P -BGA-165
Package Name FBGA-165 (51-85165)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free No
RoHS Compliant No
Infineon stock last updated:

Product Status
Active
Infineon Package
P -BGA-165
Package Name FBGA-165 (51-85165)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

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