SG-WLL-2-11

Download 3D model

Package details

  • Package Material
    SG
  • Package Family
    SG-WLL
  • Terminals
    2
  • Variant
    11
  • Exposed Paddle
    No
  • Body Length (mm)
    0.58
  • Body Width (mm)
    0.28
  • Min. Terminal Pitch ()
    0.0
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    15000
    1
    180
Infineon chip size wafer level leadless devices (WLL) are offered as different variants. Alternative designations are chip-scale package (CSP). The size of the bare silicon component is equal to that of the die. The mounting pads are processed directly on the silicon body. The devices feature smallest dimensions and are therefore especially appropriate for miniaturization in applications with limited space. They are available with a 0201 (imperial code, relates to 0603 metric code) and 01005 (imperial code, relates to 0402 metric code). The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). The silicon body requires special care when handling boards with mounted components. Typical products are multi-purpose and low capacitance ESD devices.

Image Gallery

SG-WLL-2-11_Footprint Drawing
SG-WLL-2-11_Footprint Drawing
SG-WLL-2-11_Footprint Drawing SG-WLL-2-11_Footprint Drawing SG-WLL-2-11_Footprint Drawing
SG-WLL-2-11_Tape and Reel_01 SG-WLL-2-11_Tape and Reel_01 SG-WLL-2-11_Tape and Reel_01
SG-WLL-2-11_Package Outline SG-WLL-2-11_Package Outline SG-WLL-2-11_Package Outline
×
modalImg

Documents and drawings

Documents and drawings