DFN-8 (002-18755)

PG-WSON-8-802

Package details

  • Package Material
    PG
  • Package Family
    PG-WSON
  • Terminals
    8
  • Variant
    802
  • Exposed Paddle
    Yes
  • Body Length (mm)
    6.0
  • Body Width (mm)
    5.0
  • Min. Terminal Pitch (mm)
    1.27
Infineon small outline non-leaded (SON) packages are offered as various families. The thin tri-side flat-pack non-leaded packages (TTFN) use three sides of the package outline for termination access instead the otherwise used dual side approach of the therefore also called dual flat non-leaded packages (DFN). Alternative designations may include power quad flat no-lead (PQFN). Further designations for TDSON-8 packages include 'super small-outline 8 pin' or 'SuperSO8' (SSO8, S2O8). The TSDSON-8 package can also be found as 'Shrink SuperSO8' (S3O8). The double-side cooling (DSC) concept is available to some of the variants. It allows for adding an additional thermal drain to the top of the component. Specific packages from the SON family are for example offered with DSC features. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Several package families such as TDSON and TSON offer versions with additional lead tip inspection (LTI) features for automated optical inspection (AOI) of wettable flanks. Typical products are GaN and MOSFET transistors, voltage gate drivers, linear voltage regulators, switches, transeivers, gate driver IC, diodes, current sensors, and more.

Image Gallery

PG-WSON-8-802_Footprint Drawing
PG-WSON-8-802_Footprint Drawing
PG-WSON-8-802_Footprint Drawing PG-WSON-8-802_Footprint Drawing PG-WSON-8-802_Footprint Drawing
PG-WSON-8-802_Package Outline PG-WSON-8-802_Package Outline PG-WSON-8-802_Package Outline
×
modalImg

Documents and drawings

Documents and drawings