PG-WFWLB-52-3

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Package details

  • Package Material
    PG
  • Package Family
    PG-WFWLB
  • Terminals
    52
  • Variant
    3
  • Exposed Paddle
    No
  • Body Length (mm)
    3.63
  • Body Width (mm)
    3.63
  • Min. Terminal Pitch (mm)
    0.4
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    2000
    1
    180
Infineon wafer level ball grid array packages (WLB) are offered as various families. They are available as very thin (V), very very thin (W), ultra thin (U), and extemely thin (X) versions. Alternative and legacy designations are embedded WLB (eWLB), wafer level chip scale package (WLCSP) or wafer level ball grid array (WLBGA) package. The embedded WLB feature a minimum plastic mold body that can be rectangular or square. They are chip scale packages with fan-in/fan-out redistribution layer that marginally extends over the silicon die. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). Typical products are radar sensors, micro controllers, magnetic sensors, and more.

Image Gallery

PG-WFWLB-52-3_Footprint Drawing
PG-WFWLB-52-3_Footprint Drawing
PG-WFWLB-52-3_Footprint Drawing PG-WFWLB-52-3_Footprint Drawing PG-WFWLB-52-3_Footprint Drawing
PG-WFWLB-52-3_Tape and Reel_01 PG-WFWLB-52-3_Tape and Reel_01 PG-WFWLB-52-3_Tape and Reel_01
PG-WFWLB-52-3_Package Outline PG-WFWLB-52-3_Package Outline PG-WFWLB-52-3_Package Outline
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Documents and drawings

Documents and drawings