WQFN-24 (002-18982)

PG-VQFN-24-808

Package details

  • Package Material
    PG
  • Package Family
    PG-VQFN
  • Terminals
    24
  • Variant
    808
  • Exposed Paddle
    Yes
  • Body Length (mm)
    4.0
  • Body Width (mm)
    4.0
  • Min. Terminal Pitch (mm)
    0.5
Infineon quad flat nonleaded (QFN) packages are offered as various families. Alternative and legacy designations may be micro-leadframe package quad (MLPQ). The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products are gate driver ICs, oscillators, gate drivers, voltage regulators, microcontrollers, audio amplifier ICs, motor driver ICs, wireless charging ICs, and more.

Image Gallery

PG-VQFN-24-808_Tape and Reel
PG-VQFN-24-808_Tape and Reel
PG-VQFN-24-808_Tape and Reel PG-VQFN-24-808_Tape and Reel PG-VQFN-24-808_Tape and Reel
PG-VQFN-24-808_Bakeable Trays PG-VQFN-24-808_Bakeable Trays PG-VQFN-24-808_Bakeable Trays
PG-VQFN-24-808_Footprint Drawing PG-VQFN-24-808_Footprint Drawing PG-VQFN-24-808_Footprint Drawing
PG-VQFN-24-808_Package Outline PG-VQFN-24-808_Package Outline PG-VQFN-24-808_Package Outline

Documents and drawings