PG-TO247-3-48

Download 3D model

Package details

  • Package Material
    PG
  • Package Family
    PG-TO247
  • Terminals
    3
  • Variant
    48
  • Exposed Paddle
    Yes
  • Body Length (mm)
    21.0
  • Body Width (mm)
    15.8
  • Min. Terminal Pitch (mm)
    5.44
  • TUBE
    Pieces/Reel
    Reels/Box
     
    240
    8
Infineon through-hole transistor outline type packages are offered as various families. They are available as transistor outline (TO) and heatslug singe inline packages (HSIP). Alternative designation examples are IPAK for TO251-3 and I2PAK for TO262-3. Fully isolated package versions without open metal lug are called 'FullPAK'. Packages featuring an increased heatsink area are marked as 'Plus' version. Some packages feature leads with extended or reduced length called 'long lead' and 'short lead' versions. The heat sink can either be mounted on the board or can be equipped with an additional heatspreader. To support this, there are package versions with screw mounting hole available. The straight lead termination design allows for high robustness board mounting using through-hole technology (THT). The leads of THD are inserted in drilled holes of the board prior to soldering. During pre-mount processing special care must be taken e.g. during lead bending. Typical products are diodes, IGBT discretes, N-channel and P-channel MOSFET, linear voltage regulators, switches, full-bridge ICs, and more.

Image Gallery

PG-TO247-3-48_Package Outline
PG-TO247-3-48_Package Outline
PG-TO247-3-48_Package Outline PG-TO247-3-48_Package Outline PG-TO247-3-48_Package Outline
PG-TO247-3-48_Tube PG-TO247-3-48_Tube PG-TO247-3-48_Tube
×
modalImg

Documents and drawings

Documents and drawings