PG-LQFP-100-25

Package details

  • Package Material
    PG
  • Package Family
    PG-LQFP
  • Terminals
    100
  • Variant
    25
  • Exposed Paddle
    Yes
  • Body Length (mm)
    14.0
  • Body Width (mm)
    14.0
  • Min. Terminal Pitch (mm)
    0.5
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1000
    1
    330
  • TRAY
    Pieces/Reel
    Reels/Box
     
    540
    6
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1400
    1
    330
  • TRAY
    Pieces/Reel
    Reels/Box
     
    90
    1
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-LQFP-100-25_Footprint Drawing
PG-LQFP-100-25_Footprint Drawing
PG-LQFP-100-25_Footprint Drawing PG-LQFP-100-25_Footprint Drawing PG-LQFP-100-25_Footprint Drawing
PG-LQFP-100-25_Tape and Reel_01 PG-LQFP-100-25_Tape and Reel_01 PG-LQFP-100-25_Tape and Reel_01
PG-LQFP-100-25_Package Outline PG-LQFP-100-25_Package Outline PG-LQFP-100-25_Package Outline
PG-LQFP-100-25_Bakeable Trays PG-LQFP-100-25_Bakeable Trays PG-LQFP-100-25_Bakeable Trays
PG-LQFP-100-24,-25-TP PG-LQFP-100-24,-25-TP PG-LQFP-100-24,-25-TP

Documents and drawings