FBGA-144 (002-13492)

PG-LFBGA-144-802

Package details

  • Package Material
    PG
  • Package Family
    PG-LFBGA
  • Terminals
    144
  • Variant
    802
  • Exposed Paddle
    No
  • Body Length (mm)
    11.0
  • Body Width (mm)
    11.0
  • Min. Terminal Pitch (mm)
    0.8
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    1500
    1
Infineon ball grid array (BGA) packages are offered as various families. They are available as low (L), thin (T), and very thin (V) profile versions. Finepitch (F) products as well as flip-chip (FC) versions are specifically designated. Legacy designations my include ultra fine ball grid array (UFBGA) or very very thin profile fine pitch ball grid array (WFBGA). The BGA concept typically utilizes an overmolded laminate substrate with fanout to connect on the bottom of the package rather than around its perimeter. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). The footprints are usually symmetric and the solder ball terminations provide a stable stand-off after board mounting. Typical products are a high number of signal lines e.g. for microcontrollers and memory.

Image Gallery

PG-LFBGA-144-802_Footprint Drawing
PG-LFBGA-144-802_Footprint Drawing
PG-LFBGA-144-802_Footprint Drawing PG-LFBGA-144-802_Footprint Drawing PG-LFBGA-144-802_Footprint Drawing
PG-LFBGA-144-802_Package Outline PG-LFBGA-144-802_Package Outline PG-LFBGA-144-802_Package Outline
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Documents and drawings

Documents and drawings