SOIC-8 (002-15548)

PG-DSO-8-807

Package details

  • Package Material
    PG
  • Package Family
    PG-DSO
  • Terminals
    8
  • Variant
    807
  • Exposed Paddle
    No
  • Body Length (mm)
    5.283
  • Body Width (mm)
    8.001
  • Min. Terminal Pitch (mm)
    1.27
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    2100
    1
Infineon dual small outline (DSO) packages are offered as various families. They are available as low profile (L), thin (T), and very thin shrink (TS) versions. Types for advanced heat dissipation (H) are specifically designated. Alternative designations are small outline (SO) or small outline integrated circuit (SOIC) packages. The lead frame based packages offer diverse configurations when it comes to die pads and heat slugs. The dual row gullwing shaped leads allow for high-throughput board mounting using surface mount technology (SMT). The lead construction causes a stand-off distance between the gullwing foot landing area and the exposed die pad plane which has to be considered during board mount design. Typical products are switches, sensor, field-effect transistors, linear voltage regulators, half-bridge ICs, power controllers, and more.

Image Gallery

PG-DSO-8-807_Bakeable Trays
PG-DSO-8-807_Bakeable Trays
PG-DSO-8-807_Bakeable Trays PG-DSO-8-807_Bakeable Trays PG-DSO-8-807_Bakeable Trays
PG-DSO-8-807_Tape and Reel PG-DSO-8-807_Tape and Reel PG-DSO-8-807_Tape and Reel
PG-DSO-8-807_Footprint Drawing PG-DSO-8-807_Footprint Drawing PG-DSO-8-807_Footprint Drawing
PG-DSO-8-807_Package Outline PG-DSO-8-807_Package Outline PG-DSO-8-807_Package Outline
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Documents and drawings

Documents and drawings