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Board Assembly Recommendations (SSO) Addendum

The purpose of this PG-SSO module assembly Application Note is to highlight in one table all the DOS and DON’ts especially focused for the correct handling during the module assembly process-steps at distributor/tier1 of our high volume leaded PG-SSO-X-x- magnetic Sensor packages/TLE types. (see Table of Contents and module process flow figure in this Application Note) Target is to avoid unnecessary external stress factors such as those caused by handling, overmolding, glueing, welding, lead bending or forming, lead clipping or trimming, or clamping. And explain the preferred handling procedure and rules for PG-SSO packages.

1.40 MB
Feb 11, 2025