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Properties of a New PrimePACK™ IGBT Module Concept

We present a new power module concept that is specifically optimized for the integration in a modern converter. The most important benefits are improved thermal properties, a low stray inductance and an advantageous interface to both driver board and load circuitry. Studies on the device performance are presented based on measurements and numerical simulations. The PrimePACK™ design is characterized by a slim geometry of the power module. It has advantages both in thermal and electrical respects. It supports enhanced heat spreading inside the module and from the module baseplate to the heatsink and it focuses on a low internal stray inductance of ~10nH for the whole commutation loop if the large version is considered. The housing concept is flexible and offers economical solutions concerning the mechanical integration into a power converter.

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Feb 07, 2014