Active and preferred
RoHS Compliant

DEMO_HV_PACKAGE

Advantages of Infineon's high-voltage power packages
Application Notes

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DEMO_HV_PACKAGE
DEMO_HV_PACKAGE
Application Notes

Product details

  • Board Type
    Demo Board
  • Dimensions
    186 x 83 x 31 mm
  • Family
    MOSFET
Recommended
OPN
DEMOHVPACKAGETOBO1
Product Status active and preferred
Infineon Package --
Package Name N/A
Packing Size 1
Packing Type CONTAINER
Moisture Level N/A
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package --
Package Name -
Packing Size 1
Packing Type CONTAINER
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Discover the benefits of Infineon's high-voltage power packages, featuring CoolSiC™ and CoolMOS™ technology. The Demo_HV_package board helps designers understand how to integrate our bottom- and top-side cooled packages effectively into their designs. Benefit from simplified assembly and reduced design complexity to achieve optimal thermal performance for highest efficiency and power density at lower system cost.

Features

  • Improved power loop design
  • Innovative cooling concepts: BSC & TSC
  • Optimized design of the half bridge
  • Lower stray inductance
  • Kelvin source pin
  • 3D concept: cooling & power loop integr.

Benefits

  • Faster & cheaper in production assembly
  • Higher switching capabilities
  • Better control & reduced power losses
  • Possibility of double side PCB assembly

Applications

Bill of Material

Documents

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Design resources

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