ToF 3D image sensors for consumer and industrial
REAL3™ 3D image sensor based on Infineon ToF (Time-of-Flight) technology - powering the smallest depth-sensing 3D camera modules in the market
Infineon’s REAL3™ image sensor family opens up a completely new world of exciting applications for devices deployed in consumer and industrial markets, while also setting new performance and security benchmarks for existing use cases.
The REAL3™ image sensors are based on Infineon ToF (Time-of-Flight), which is the most advanced vision sensing technology in the world today and is already powering the smallest depth-sensing 3D camera modules on the market.
Infineon’s REAL3™ 3D image sensor delivers depth data in real time with a capture speed in the order of milliseconds; it is contact-less, fast and robust to ambient lightning conditions. Thanks to its patented technology for suppression of background illumination (SBI), REAL3™ supports camera deployments under all ambient light conditions. REAL3™ time-of-flight image sensors allow electronic devices to build a 3-dimensional map of the scene in front of the electronic gadget – whether that be a room, a moving or static object or a person – and translate that map to the digital world in real time. Advanced algorithms use that data to measure distance and size and to track motion and movements.
In addition, the single-chip REAL3™ imager brings a third dimension to biometric identification, to 3D scanning and to hand gesture and body tracking. Outstanding performance in 3D computational photography and augmented reality applications revolutionize the user experience.
The REAL3™ product portfolio for consumer and industrial applications comprises dedicated single-chip 3D image sensors delivered in bare die form:
|IRS2875C||sampling now||Bare die||43k||240 x 180||940 nm||Computational photography (Bokeh, auto-focus), long range scanning, augmented reality, robotics||yes|
|IRS2877C||volume production||Bare die||307.2k||640 x 480||940 nm||Face authentication, high resolution scanning, computational photography (Bokeh, auto-focus), augmented reality||yes|
|IRS2381C||volume production||Bare die||38.5k||224 x 172||940 nm||smartphone/
|IRS1645C||volume production||Bare die||38.5k||224 x 172||850 nm||robotics||yes|
The REAL3™ product portfolio also comprises imagers for automotive applications.
The consumer grade ToF imagers are only available as bare die and targeting high volume applications. If you are looking for a complete ToF camera module to directly use the 3D pointcloud in your application we have a partner network of modulemaker and camera designhouses established.
If you are interested to find the right partner or to learn more about the REAL3 product portfolio please contact our Support Center by providing us some basic information about your application requirements.
Press releases & market news
- Press release Jun 23, 2021: Infineon and pmdtechnologies partner with ArcSoft for under-display Time-of-Flight turnkey solution
Gaming, virtual e-Commerce, 3D online education: Augmented Reality (AR) applications with three-dimensional depth sensors link the real with the digital world and are strongly demanded. Infineon Technologies AG and pmdtechnologies developed a 3D depth sensor based on the Time of Flight (ToF)-technology which outperforms other solutions in the market and aims for target applications that offer a wider spectrum of innovative consumer usability. The 3D sensor market in smartphones for rear side cameras is expected to grow up to more than 500 million units per year until 2024. Read more
- Press release March 5, 2020: Infineon collaborates with Qualcomm to enable high-quality standard solution for 3D authentication
Press release Feb 19, 2020 Tokyo (Japan): Sharp’s 5G Smart Phone has video with background photo and video bokeh-effect uses Infineon REAL3™ 3D Image Sensor
- Press release Jan 06, 2020: Infineon presents the world´s smallest 3D image sensor for face authentification and photo effects on smartphones
- Market news May 23, 2019: Embedded Vision Alliance awards REAL3 image sensor as “Product of the Year”
- Press release Feb 25, 2019: REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects
- Press release Feb 24, 2019: Featuring Infineon’s Time-of-Flight technology, LG’s smartphone G8ThinQ securely recognizes your face
- Press release Feb 7, 2019: With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera
- Press release Jan 5, 2018: 3D image sensor - Infineon enables easy smartphone unlock by face recognition
3D ToF reference camera modules
To help you evaluate REAL3™ time-of-flight technology, we have developed various 3D reference cameras. The CamBoard pico family is designed by our development partner pmdtechnologies. These reference cameras come with a powerful SDK providing a high-quality depth map for evaluation and application software development. They feature flexible working ranges and frame rates, and support Windows, Android and MacOS. For further details and to order one of these reference cameras, please visit http://pmdtec.com/picofamily/
The data provided by a Time-of-Flight camera can be used in a variety of applications:
Personal consumer electronics:
- Smartphones and tablets
- Head-mounted devices
- Robot Vacuum Cleaner
- Social and entertainment robots
Home security and monitoring systems:
- 3D-Face ID door opener and access control
- Area surveillance
- People counting
- Collaborative robots
- Warehouse and delivery robots
- Facial authentication