MEMS microphones for consumer
High performance analog and digital XENSIV™ MEMS microphones for consumer electronics
Infineon’s XENSIV™ MEMS microphones are designed for capturing audio signals with unprecedented precision and quality. The microphones are comprised of Infineon’s MEMS microphone chips and ASICs which are not without reason the world’s best-selling microphone components.
XENSIV™ MEMS microphones feature ultra-low self-noise (high SNR), extremely low distortions (THD) even at high sound pressure levels (SPL), very tight part-to-part phase and sensitivity matching, a flat frequency response with a low LFRO (low frequency roll-off) and an ultra-low group delay. Combined with selectable power modes and their very small package size, Infineon XENSIV™ MEMS microphones are a perfect match for consumer electronics with excellent audio capturing functionalities and also for selected industrial applications such as predictive maintenance and security.
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- Ultra-low self-noise / ultra-high SNR
- Selectable power modes
- Sealed Dual Membrane (SDM) technology with ingress protection at microphone level
- Extremely low distortions (THD) even at high sound pressure levels
- High dynamic range and very high acoustic overload points (AOP)
- Very tight part-to-part phase and sensitivity matching
- Flat frequency response with a low LFRO (low frequency roll-off)
- Ultra-low group delay
- Very small package sizes
Infineon’s Sealed Dual Membrane (SDM) MEMS technology
Infineon’s latest Sealed Dual Membrane MEMS technology delivers high ingress protection (IP57) at a microphone level. The sealed MEMS design prevents water or dust from entering between membrane and backplate, preventing mechanical blockage or electric leakage issues commonly observed in MEMS microphones. Microphones built with the sealed dual membrane technology can be used to create IP68 devices, requiring only minimal mesh protection.
Typical applications and use-cases
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