XENSIV™ MEMS ultrasonic transceivers
Imagine a microphone that can hear and see

Best in class XENSIV™ MEMS microphones with ultrasonic capabilities

Discover how the high performing Infineon XENSIVTM MEMS microphones can be successfully enhanced with ultrasonic transmission and reception capabilities in order to track reflecting objects.

The same miniaturized unit can now act as sensor in the audible and ultrasonic frequency range but also as actuator in the ultrasonic one, forming a complete transceiver (3-in-1).

Small footprint and reduced power consumption make our innovative technology an excellent candidate for miniaturized battery-driven applications that combine both high quality audio features and 3D sensing.

Do you already have a project in mind that combines the two technologies?

We invite you to contact us to discuss how we can support you in bringing your idea to life.

What is ultrasound? Learn more about this disruptive technology!

Ultrasound is a sound wave characterized by a frequency higher than the human ear can detect. It includes all sounds with wave frequencies higher than 20 kHz.

Ultrasound is used in many different fields. Ultrasonic devices are used to detect objects and measure distances. Ultrasound imaging or sonography is used in medicine. Animals such as bats and dolphins use ultrasonic waves for locating prey and obstacles.

XENSIV™ MEMS ultrasonic transceivers

Discover unique microphones that not only have studio-level audio performances, but also additional ultrasonic sensing and receiving capabilities.

IM67D131UT and  IM70A135UT are designed for applications that require a microphone with extended capabilities into the ultrasonic range, for both receiving and sending ultrasonic pulses.

They are perfect for devices with built-in XENSIV™ MEMS microphones that want to benefit from any of the multiple uses of ultrasound.


Product overview

ES - IM70A135UT

ES - IM67D131UT

  • Analog interface
  • Package size: 3.6 x 2.5 x 1.0 mm3
  • 70dB(A) Signal-to-Noise Ratio
  • AOP ~135dB SPL
  • Tight sensitivity (-38 ±1dB)
  • ~45Hz low frequency roll-off
  • 225µA current consumption in high performance mode
  • PDM digital interface
  • Package size: 3.6 x 2.5 x 1.0 mm3
  • 67dB(A) Signal-to-Noise Ratio
  • AOP ~131dB SPL
  • Tight sensitivity (-36 ±1dB)
  • ~45Hz low frequency roll-off
  • 1100 µA current consumption in high performance mode

Application examples

XENSIV™ evaluation board for MEMS ultrasonic transceivers

The evaluation board is developed to evaluate the Infineon transceivers.

It is designed to showcase how an established technology can be also used for target tracking in a three-dimensional space.

The detection is based on four different transceivers placed on the upper shield. Transceivers placement can be easily readapted depending on the desired use-case.


Summary of features

  • Audio and ultrasonic data streaming over USB interface (USB audio 2.0)
  • 192 kHz sampling rate
  • 24-bit four-channel audio data
  • Serial interface to send and receive configuration parameters
  • Powered through Micro-USB


We invite you to contact us to discuss how we can support you UltrasonicMEMS@infineon.com


Watch video and learn more about XENSIV™ MEMS ultrasonic transceivers