Revolutionary CoolMOS™ superjunction MOSFET technologies require innovative package solutions to enable tomorrow's trends
Low power applications are typically sold into the price sensitive consumer world where customers are closely looking into BOM cost savings. To allow savings Infineon offers special package features that avoids additional assembly treatments on customer side as well as smaller packages, enabled by our outstanding superjunction technology.
High power applications are very performance oriented. To further improve efficiency and thermal behavior, even by considering smaller form factors, Infineon introduced packages with Kelvin Source functionality and with DDPAK the first top side cooled SMD package.