Active and preferred
RoHS Compliant
Lead-free

S26HL512TFPBHB010

Data Sheet
package

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

S26HL512TFPBHB010
S26HL512TFPBHB010
Data Sheet

Product details

  • Classification
    ISO 26262-compliant
  • Density
    512 MBit
  • Family
    HL-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 105 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Automotive
Recommended
OPN
S26HL512TFPBHB010
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S26HL512TFPBHB010 is a 512 Mb automotive-grade NOR Flash memory with HYPERBUS™ interface, based on Infineon's 45-nm MIRRORBIT™ technology. It supports HYPERBUS™ DDR up to 166 MHz (333 MBps) and legacy SPI, with flexible sector architecture (4 KB/256 KB hybrid or uniform). Endurance Flex enables up to 1,280,000 cycles or 25 years retention. ISO 26262 ASIL-B compliant and ASIL-D ready, it features ECC, CRC, SafeBoot, and operates from -40°C to +125°C (AEC-Q100).

Features

  • 45-nm MIRRORBIT technology, 2 bits/cell
  • Configurable sector architecture:
  • 256/512-byte page programming buffer
  • OTP secure silicon region (SSR) 1024 bytes
  • HYPERBUS and legacy SPI interfaces
  • DDR up to 400 MBps, SDR up to 21 MBps
  • Embedded ECC: single-bit correction,
  • Interface and data integrity CRC
  • SafeBoot and AutoBoot features
  • Advanced sector protection
  • Endurance Flex: high endurance/long retention
  • JEDEC xSPI (JESD251) compatibility

Benefits

  • High density and reliability for demanding
  • Flexible memory mapping for design freedom
  • Fast programming speeds boost throughput
  • Secure storage for sensitive data
  • Easy integration with multiple host
  • High data rates enable rapid data access
  • Enhanced data integrity and error resilience
  • Communication errors detected and corrected
  • Fast, reliable boot and recovery
  • Fine-grained memory protection options
  • Customizable endurance for varied needs
  • Industry-standard compatibility for broad use

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }