PG-ATSLP-10-3

Package details

  • Package Material
    PG
  • Package Family
    PG-ATSLP
  • Terminals
    10
  • Variant
    3
  • Exposed Paddle
    Yes
  • Body Length (mm)
    1.1
  • Body Width (mm)
    1.5
  • Min. Terminal Pitch (mm)
    0.4
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    4500
    1
    180
Infineon thin small leadless packages (TSLP) are offered as various families. They are available as advanced thin (AT) and thin super (TS) versions. Their small outline and leadframe-less construction makes them ideal for light-weight applications. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Drop-in solutions with identical footprint may be found the package family of thin small nonleaded packages (TSNP). Typical applications are linear voltage regulators, switches, tuners, diodes, ESD devices, RF mixers, general purpose and RF transistors, and more.

Image Gallery

PG-ATSLP-10-3_Footprint Drawing
PG-ATSLP-10-3_Footprint Drawing
PG-ATSLP-10-3_Footprint Drawing PG-ATSLP-10-3_Footprint Drawing PG-ATSLP-10-3_Footprint Drawing
PG-ATSLP-10-3_Package Outline PG-ATSLP-10-3_Package Outline PG-ATSLP-10-3_Package Outline
PG-ATSLP-10-3_Tape and Reel PG-ATSLP-10-3_Tape and Reel PG-ATSLP-10-3_Tape and Reel
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Documents and drawings

Documents and drawings