Active and preferred
RoHS Compliant

EV INV HPD2 SI FS1150 08

Inverter evaluation Kit for HybridPACK™ Drive G2 IGBT Automotive Power Module FS1150R08A8P3 including gate driver board, phase current sensor and logic board
User Manual
ea.
in stock

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

EV INV HPD2 SI FS1150 08
EV INV HPD2 SI FS1150 08
ea.
User Manual

Product details

  • Board Type
    Evaluation Board
  • Description
    The inverter evaluation kit for HybridPACK™ Drive G2 IGBT is tailored for B6-bridge xEV main inverter applications. It features the latest market benchmark setting Infineon power module: HybridPACK™ Drive G2 IGBT FS1150R08A8P3. Alongside the latest EiceDriver™ gate drivers and Xensiv™ current sensors, this kit supports engineers during design-in activities. Open design files enable convenient evaluation and quick start of cross-reference tests.
  • Family
    MOSFET
  • Input Type
    DC
  • Qualification
    Automotive
  • Sub Application
    (Hybrid) electrical vehicles (H)EV, Motor drives, Commercial, construction and agricultural vehicles (CAV)
  • Supply Voltage
    10 V to 18 V
  • Target Application
    Automotive
  • Topology
    Full Bridge
Recommended
OPN
EVINVHPD2SIFS115008TOBO2
Product Status active and preferred
Infineon Package N/A
Package Name N/A
Packing Size 1
Packing Type CONTAINER
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package N/A
Package Name -
Packing Size 1
Packing Type CONTAINER
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The inverter evaluation kit for HybridPACK™ Drive G2 IGBT is tailored for B6-bridge xEV main inverter applications. It features the latest market benchmark setting Infineon power module: HybridPACK™ Drive G2 IGBT FS1150R08A8P3. Alongside the latest EiceDriver™ gate drivers and Xensiv™ current sensors, this kit supports engineers during design-in activities. Open design files enable convenient evaluation and quick start of cross-reference tests.

Features

  • Support for HybridPACK™ Drive G2
  • EiceDriver™ compatibility
  • Aurix™ microcontroller integration
  • Valuable design insights
  • Ideal for sequential development
  • Facilitates practical lab experience
  • Hands-on exploration of power module
  • Gate driver feature assessment
  • Phase current sensor performance testing

Benefits

  • Save design time
  • Ease-of-use
  • Fast IGBT power module evaluation 
  • Cross-reference test

Applications

Bill of Material

Documents

Documents

Design resources

Partner solutions