FF1MR12MM1HP_B11 CoolSiC™ MOSFET half-bridge module 1200 V
Overview
EconoDUAL™ 3 CoolSiC™ MOSFET half-bridge module 1200 V, 1.4 mΩ with enhanced generation 1, integrated NTC temperature sensor, PressFIT contact technology, and pre-applied Thermal Interface Material. Also available with wave structure on the back side of the base plate for direct liquid cooling (FF1MR12MM1HW_B11).
Summary of Features
- Low switching losses
- Superior gate oxide reliability
- Higher gate threshold voltage
- Higher power output
- Robust integrated body diode
- High cosmic ray robustness
- High speed switching module
- Tvj op = 175°C overload
- PressFIT Pins
- Screw power terminals
- Integrated NTC temperature sensor
- Isolated baseplate
Benefits
- High switching frequency
- Reduced volume and size
- Reduction of system costs
- High thermal efficiency
Diagrams
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