The AIROC™ CYW89829 Bluetooth® LE MCU is Infineon’s latest automotive qualified addition to the AIROC™ CYW20829 family. The CYW20829 platform is a proven Bluetooth LE MCU in real world applications from up 2.3 km long range to exceptional throughput in an office environment. Leveraging the benefits and foundation of the CYW20829 family, the CYW89289 is a high-performance, ultra-low power integrated dual Arm® Cortex®-M33 MCU built for industrial and automotive Bluetooth® applications.

Summary of Features

  • Automotive AECQ-100 Grade 2 Qualified Integrated Bluetooth® LE 5.4 MCU
  • Offered in BGA77 and QFN40 packages
  • 96 MHz ARM Cortex M33 – Application MCU
  • 48 MHz ARM Cortex M33 – Bluetooth® Subsystem
  • 256 KB / 96 KB SRAM – Bluetooth® LE
  • 48 MHz QSPI/SMIF with XIP, 32 KB cache
  • On-the-fly encryption for off-chip flash
  • “Secure Boot” & Crypto HW engine
  • TX Power: up to +10 dBm
  • Robust RX sensitivity of -106 dBm
  • Up to 3.6 V supply voltage
  • Up to 26 programmable GPIOs
  • Up to 105°C operating temperature
  • Up to 8 Mb integrated flash

Benefits

  • Automotive qualified for streamlined integration
  • Industry’s best range and noise immunity
  • Future proof your designs and unlock new use cases with Bluetooth LE 5.4
  • Reduce system cost with highly integrated MCU and “right sized” external flash
  • Longer battery life with low power connection

 

Design for the future. Full featured Bluetooth LE 5.4 with industry best range and low power performance.

Designing for the future with complete Bluetooth LE 5.4 features is a breeze using the CYW89829, offering unmatched reliability and connected range with an integrated power amplifier for 10 dBm of transmit output power and a remarkable RX sensitivity of -98 dBm for Bluetooth® LE 1Mbps.

 

Simplify and streamline integration. Highly integrated MCU with CAN FD, LIN, and rich peripherals and using “right-sized” external flash

Beyond its connectivity prowess, the CYW89829 MCU impresses with high-level of integration and automotive qualification leading to reduced BOM and certification costs. It combines a powerful 96 MHz Arm® Cortex®-M33 MCU and a secondary Arm® Cortex®-M33 dedicated for the Bluetooth® controller. CYW89829 comes with 256 KB of Application SRAM, an XIP capable Quad SPI interface to allow for a wide selection of external flash, and a diverse range of peripherals, including CAN FD, LIN, PDM, I2S, ADC, timers.

 

Design and build with Infineon security expertise. Full automotive AECQ-100 Grade 2 qualification.

Security and privacy are core to Infineon, and the CYW89829 was designed with this in mind. In addition to its PSA level 1 certification, it also comes with support for secure boot, secure execution environment, a TRNG, eFuse for custom keys, and cryptography acceleration - safeguarding sensitive data.

 

Bring your ideas and solutions to life. Software infrastructure proven to accelerate and streamline development.

AIROC™ CYW89829 is currently available for sampling in two packages: BGA77 and QFN40. The CYW89829 is also complemented by a rich and proven software infrastructure, offering extensive code examples and an easy-to-use development environment. This combination provides unparalleled flexibility and simplifies even the most complex application deployments.

Order an evaluation kit here

Sampling Now

77BGA Block Diagram

CYW89829 Block Diagram
CYW89829 Block Diagram
CYW89829 Block Diagram

40QFN Block Diagram

CYW89829 Block Diagram
CYW89829 Block Diagram
CYW89829 Block Diagram
CYW89829 Package Table
CYW89829 Package Table
CYW89829 Package Table

The AIROC™ CYW89829 Bluetooth® LE MCU is Infineon’s latest automotive qualified addition to the AIROC™ CYW20829 family. The CYW20829 platform is a proven Bluetooth LE MCU in real world applications from up 2.3 km long range to exceptional throughput in an office environment. Leveraging the benefits and foundation of the CYW20829 family, the CYW89289 is a high-performance, ultra-low power integrated dual Arm® Cortex®-M33 MCU built for industrial and automotive Bluetooth® applications.

Summary of Features

  • Automotive AECQ-100 Grade 2 Qualified Integrated Bluetooth® LE 5.4 MCU
  • Offered in BGA77 and QFN40 packages
  • 96 MHz ARM Cortex M33 – Application MCU
  • 48 MHz ARM Cortex M33 – Bluetooth® Subsystem
  • 256 KB / 96 KB SRAM – Bluetooth® LE
  • 48 MHz QSPI/SMIF with XIP, 32 KB cache
  • On-the-fly encryption for off-chip flash
  • “Secure Boot” & Crypto HW engine
  • TX Power: up to +10 dBm
  • Robust RX sensitivity of -106 dBm
  • Up to 3.6 V supply voltage
  • Up to 26 programmable GPIOs
  • Up to 105°C operating temperature
  • Up to 8 Mb integrated flash

Benefits

  • Automotive qualified for streamlined integration
  • Industry’s best range and noise immunity
  • Future proof your designs and unlock new use cases with Bluetooth LE 5.4
  • Reduce system cost with highly integrated MCU and “right sized” external flash
  • Longer battery life with low power connection

 

Design for the future. Full featured Bluetooth LE 5.4 with industry best range and low power performance.

Designing for the future with complete Bluetooth LE 5.4 features is a breeze using the CYW89829, offering unmatched reliability and connected range with an integrated power amplifier for 10 dBm of transmit output power and a remarkable RX sensitivity of -98 dBm for Bluetooth® LE 1Mbps.

 

Simplify and streamline integration. Highly integrated MCU with CAN FD, LIN, and rich peripherals and using “right-sized” external flash

Beyond its connectivity prowess, the CYW89829 MCU impresses with high-level of integration and automotive qualification leading to reduced BOM and certification costs. It combines a powerful 96 MHz Arm® Cortex®-M33 MCU and a secondary Arm® Cortex®-M33 dedicated for the Bluetooth® controller. CYW89829 comes with 256 KB of Application SRAM, an XIP capable Quad SPI interface to allow for a wide selection of external flash, and a diverse range of peripherals, including CAN FD, LIN, PDM, I2S, ADC, timers.

 

Design and build with Infineon security expertise. Full automotive AECQ-100 Grade 2 qualification.

Security and privacy are core to Infineon, and the CYW89829 was designed with this in mind. In addition to its PSA level 1 certification, it also comes with support for secure boot, secure execution environment, a TRNG, eFuse for custom keys, and cryptography acceleration - safeguarding sensitive data.

 

Bring your ideas and solutions to life. Software infrastructure proven to accelerate and streamline development.

AIROC™ CYW89829 is currently available for sampling in two packages: BGA77 and QFN40. The CYW89829 is also complemented by a rich and proven software infrastructure, offering extensive code examples and an easy-to-use development environment. This combination provides unparalleled flexibility and simplifies even the most complex application deployments.

Order an evaluation kit here

Sampling Now

77BGA Block Diagram

CYW89829 Block Diagram
CYW89829 Block Diagram
CYW89829 Block Diagram

40QFN Block Diagram

CYW89829 Block Diagram
CYW89829 Block Diagram
CYW89829 Block Diagram

CYW89829 Package Table
CYW89829 Package Table
CYW89829 Package Table