Networking and switch platforms

Full LV DC-DC processor power solution for networking and switch platforms

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Overview

Discover Infineon's full power solutions for any network interface card (NIC) or networking and switch platforms. Experience our top-notch digital multiphase power solutions, ensuring unmatched efficiency, response time, and telemetry reporting. Our latest core power solutions, with TLVR technology, optimize power performance for high-current SoCs, reducing costs, and saving valuable PCB space.

Benefits

  • Supreme power conversion efficiency
  • Fastest transient response speed
  • Precise telemetry reporting
  • Reduced output capacitance
  • Lowered system costs
  • Saved valuable PCB space

Block diagram

About

About low voltage DC-DC processor power solutions for networking and switch platforms

Infineon offers a comprehensive portfolio of power components for networking switch platforms, featuring our common footprint XDP™ digital multiphase controllers and OptiMOS™ integrated smart power stages and high density dual- or quad-phase power modules. Our solution offering for core and other rails excels in power conversion efficiency, transient response speed, and precise telemetry reporting, setting the industry standard. Experience the superior capabilities of our latest core power solutions, seamlessly integrating with trans-inductor voltage regulator (TLVR) technologies. This combination delivers unparalleled power performance to high-current SoCs, while reducing output capacitance, lowering costs, and saving valuable PCB space. Choose Infineon for the ultimate power optimization in networking and switch applications.

Webinar: Power supply ICs
Introduction to trans-inductor voltage regulator (TLVR) topology

Infineon offers trans-inductor voltage regulator (TLVR) solution for high-performance systems with XDP™ digital power controllers and OptiMOS™ power stages. The TLVR topology utilizes an electrically coupled inductor concept that delivers high-speed transient response even at lower switching frequencies. Infineon’s TLVR solution offers an instant response to dynamic load changes with minimal output capacitance, which reduces the overall solution size and bill of materials (BOM) cost significantly, when compared to traditional non-coupled inductor-based designs. Operating the voltage regulator (VR) at lower switching frequencies also significantly boosts overall power conversion efficiency and reduces the total cost of ownership (TCO). Overall, TLVR configuration enables efficient, high-density, and cost-effective power management solutions for high-performance systems.

Solving the PDN problem in multiphase VR applications with TLVR

The power delivery network (PDN) forms the infrastructure that delivers power from voltage regulator to CPU and other components on the server motherboard, ensuring efficient and reliable power distribution. It plays a critical role in meeting the deviation specification in applications requiring multiphase buck converters with high di/dt load steps while having stringent output voltage deviation specifications. Rather than physically moving the multiphase VR close to the load, TLVR is an alternative method that employs transformers with 1:1 turns ratio in place of the traditional power inductors. There are various advantages of such an architecture, and almost no downsides. Download the application note or watch our summary video to find out how the Infineon TLVR solution mitigates the shortcomings of the PDN in multiphase VR applications and the advantages it brings to a multiphase VR application requiring currents of 200 A to 1000 A with high-dynamic content.

Highest current density dual-phase power modules

Infineon is addressing the escalating power requirements of generative AI factories with its second-generation DC-DC power modules: the TDM2354xD and TDM2354xT OptiMOS dual-phase power modules. These 160 A modules are designed for vertical power delivery (VPD) and set a new standard for the industry with their exceptional current density, electrical, and thermal efficiencies.


Compact and efficient design

The TDM2354xD and TDM2354xT OptiMOS dual-phase power modules feature a highly integrated design, combining two OptiMOS 6 power stages, inductors, and capacitors on a single substrate. This innovative approach enables the deployment of two phases of a multiphase buck regulator in a significantly reduced footprint – 40% smaller than equivalent discrete solutions. By minimizing the area required for power delivery, these modules help optimize the overall design and efficiency of AI systems.


Proprietary design for enhanced performance

Infineon's dual-phase power modules incorporate a proprietary inductor-on-top design, which provides improved thermal and electrical performance. This design enables superior energy efficiency in AI factory applications, making it an ideal solution for data centers and other high-performance computing environments.


High-Performance Power Modules for AI Data Centers

Infineon's OptiMOS™ TDM2454xx quad-phase power modules are designed to meet the high power demands of AI data centers, offering a peak current of 280 A. These modules boast the industry's best power density of 2.0 A/mm2, enabling true vertical power delivery (VPD) in a compact 10x9x5 mm package.


The TDM2454xx modules feature industry-leading power density, proprietary magnetics for low-profile VPD, and a footprint optimized for tiling arrays of modules. They also utilize Infineon's robust OptiMOS 6 trench technology and chip-embedded package, providing enhanced electrical and thermal efficiencies.

Explore OptiMOS™ high density dual- and quad-phase

About low voltage DC-DC processor power solutions for networking and switch platforms

Infineon offers a comprehensive portfolio of power components for networking switch platforms, featuring our common footprint XDP™ digital multiphase controllers and OptiMOS™ integrated smart power stages and high density dual- or quad-phase power modules. Our solution offering for core and other rails excels in power conversion efficiency, transient response speed, and precise telemetry reporting, setting the industry standard. Experience the superior capabilities of our latest core power solutions, seamlessly integrating with trans-inductor voltage regulator (TLVR) technologies. This combination delivers unparalleled power performance to high-current SoCs, while reducing output capacitance, lowering costs, and saving valuable PCB space. Choose Infineon for the ultimate power optimization in networking and switch applications.

Webinar: Power supply ICs

Introduction to trans-inductor voltage regulator (TLVR) topology

Infineon offers trans-inductor voltage regulator (TLVR) solution for high-performance systems with XDP™ digital power controllers and OptiMOS™ power stages. The TLVR topology utilizes an electrically coupled inductor concept that delivers high-speed transient response even at lower switching frequencies. Infineon’s TLVR solution offers an instant response to dynamic load changes with minimal output capacitance, which reduces the overall solution size and bill of materials (BOM) cost significantly, when compared to traditional non-coupled inductor-based designs. Operating the voltage regulator (VR) at lower switching frequencies also significantly boosts overall power conversion efficiency and reduces the total cost of ownership (TCO). Overall, TLVR configuration enables efficient, high-density, and cost-effective power management solutions for high-performance systems.

Solving the PDN problem in multiphase VR applications with TLVR

The power delivery network (PDN) forms the infrastructure that delivers power from voltage regulator to CPU and other components on the server motherboard, ensuring efficient and reliable power distribution. It plays a critical role in meeting the deviation specification in applications requiring multiphase buck converters with high di/dt load steps while having stringent output voltage deviation specifications. Rather than physically moving the multiphase VR close to the load, TLVR is an alternative method that employs transformers with 1:1 turns ratio in place of the traditional power inductors. There are various advantages of such an architecture, and almost no downsides. Download the application note or watch our summary video to find out how the Infineon TLVR solution mitigates the shortcomings of the PDN in multiphase VR applications and the advantages it brings to a multiphase VR application requiring currents of 200 A to 1000 A with high-dynamic content.

Highest current density dual-phase power modules

Infineon is addressing the escalating power requirements of generative AI factories with its second-generation DC-DC power modules: the TDM2354xD and TDM2354xT OptiMOS dual-phase power modules. These 160 A modules are designed for vertical power delivery (VPD) and set a new standard for the industry with their exceptional current density, electrical, and thermal efficiencies.


Compact and efficient design

The TDM2354xD and TDM2354xT OptiMOS dual-phase power modules feature a highly integrated design, combining two OptiMOS 6 power stages, inductors, and capacitors on a single substrate. This innovative approach enables the deployment of two phases of a multiphase buck regulator in a significantly reduced footprint – 40% smaller than equivalent discrete solutions. By minimizing the area required for power delivery, these modules help optimize the overall design and efficiency of AI systems.


Proprietary design for enhanced performance

Infineon's dual-phase power modules incorporate a proprietary inductor-on-top design, which provides improved thermal and electrical performance. This design enables superior energy efficiency in AI factory applications, making it an ideal solution for data centers and other high-performance computing environments.


High-Performance Power Modules for AI Data Centers

Infineon's OptiMOS™ TDM2454xx quad-phase power modules are designed to meet the high power demands of AI data centers, offering a peak current of 280 A. These modules boast the industry's best power density of 2.0 A/mm2, enabling true vertical power delivery (VPD) in a compact 10x9x5 mm package.


The TDM2454xx modules feature industry-leading power density, proprietary magnetics for low-profile VPD, and a footprint optimized for tiling arrays of modules. They also utilize Infineon's robust OptiMOS 6 trench technology and chip-embedded package, providing enhanced electrical and thermal efficiencies.

Explore OptiMOS™ high density dual- and quad-phase

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