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- Overview
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FM3 32-bit Arm® Cortex®-M3 microcontroller (MCU) families
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- FM3 CY9AFx1xK series Arm® Cortex®-M3 microcontroller (MCU)
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FM4 32-bit Arm® Cortex®-M4 microcontroller (MCU) families
- Overview
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- Overview
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32-bit TriCore™ AURIX™ – TC2x
- Overview
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32-bit TriCore™ AURIX™ – TC3x
- Overview
- AURIX™ family - TC32xLP
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- PSOC™ 4 Arm® Cortex®-M0/M0+
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- Overview
- 32-bit TRAVEO™ T2G Arm® Cortex® for body
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- Overview
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- AC-DC PWM-PFC controller
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- Diode bare dies
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- Ballast IC
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- LITIX™ - Automotive LED Driver IC
- NFC wireless configuration IC with PWM output
- VCSEL driver
- Overview
- 32-bit PSOC™ Control Arm® Cortex®-M33 MCU
- iMOTION™ Integrated motor control solutions
- MOTIX™ MCU | 32-bit motor control SoC based on Arm® Cortex®-M
- MOTIX™ motor control ICs for BLDC motors
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- Overview
- eFuse
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High-side switches
- Overview
- Classic PROFET™ 12V | Automotive smart high-side switch
- Classic PROFET™ 24V | Automotive smart high-side switch
- Power PROFET™ + 12/24/48V | Automotive smart high-side switch
- PROFET™ + 12V | Automotive smart high-side switch
- PROFET™ + 24V | Automotive smart high-side switch
- PROFET™ + 48V | Automotive smart high-side switch
- PROFET™ +2 12V | Automotive smart high-side switch
- PROFET™ Industrial | Smart high-side switch
- PROFET™ Load Guard 12V | Automotive smart high-side switch
- PROFET™ Wire Guard 12V | Automotive eFuse
- Low-side switches
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- Overview
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- Radar sensors for IoT
- Overview
- EZ-USB™ CX3 MIPI CSI2 to USB 3.0 camera controller
- EZ-USB™ FX10 & FX5N USB 10Gbps peripheral controller
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- Overview
- EZ-PD™ CCG3 USB type-C port controller PD
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- 48 V systems for EVs & mild hybrids
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Automotive BMS
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AC-DC power conversion
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Microwave ovens
Enabled by our highly efficient power switches, secured connectivity, and touch sensor technology for best cooking experience
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On this page
Overview
By choosing our components, you can easily set your designs apart from the competition. We offer a comprehensive portfolio for inverterized microwaves, that makes it easy for you to meet all consumer needs. You can aim for the best price and performance ratio with our components which are designed to work together seamlessly. This allows you to design robust and reliable systems which consumes less power and feature a modern touch user interface.
Benefits
- Secured connectivity
- Highly efficient power switches
- Reliability
- Energy efficiency
- Advanced cooking functions
- Innovation
Block diagram
About
The huge global market for microwaves is characterized by great competition and price pressure. Along with this, manufacturers must meet rising consumer expectations and produce more reliable, energy-efficient appliances that also offer more and more functions. Benefits such as faster cooking, advanced cooking functions, and easy cleaning and safety features play a crucial role. In addition, manufacturers are under enormous pressure to bring innovative new products to market as quickly as possible and at an attractive price and performance ratio. This is why inverter-operated microwaves in particular are enjoying great popularity. They combine high efficiency and increased power control at a favorable price. Inverterization helps reduce the stress of constantly switching the magnetron on and off, ensuring a long service life.
Infineon combines the industry-leading performance of the TRENCHSTOP™ family with the innovative reverse conducting IGBT technology to create a new generation of best-in-class devices. With a monolithically integrated diode, the RC-H IGBTs are perfectly suited for soft-switching application as inverterized microwave ovens.
Overcome ground-shift challenges in your design with Infineon's single-channel, non-isolated EiceDRIVER™ gate driver ICs, 1EDNx550x, that feature true differential inputs and guarantee high immunity against negative voltage undershoots and low dissipation. The 1EDNx550x gate driver ICs have true differential inputs. Their control signal inputs are largely independent of ground potential. Or use Infineon’s 1ED4417x EiceDRIVER™ 25-V single-channel low-side, non-isolated gate drivers with integrated overcurrent protection (OCP), fault reporting, and enable functionality in a 6-pin PG-SOT-23 package. The 1ED4417x family realizes best-in-class and fast fault reporting accuracy with OCP threshold tolerance of +/-5%.
PSoC™ 6 microcontrollers (MCUs) bridge the gap between expensive, power-hungry application processors, and low-power microcontrollers. The ultra-low-power PSoC™ 6 MCU features an Arm® Cortex® M4 CPU for high-performance AI/ML tasks such as _FP match algorithm, TFT LCD driver, voice recognition and motor control, and an Arm® Cortex® M0+ for low-power system control, Bluetooth® LE, and CAPSENSE™. With built-in security, your IoT system is protected. The built-in CAPSENSE™ technology allows you to easily implement robust touch control of buttons or displays.
Our AIROC™ Wi-Fi and Bluetooth® combos integrate IEEE 802.11a/b/g/n/ac WLAN and Bluetooth® in a single-chip solution to enable small-form-factor IoT designs. Combo solutions are available for both 1x1 SISO with up to 433 Mbps PHY data rates and 2x2 MIMO with up to 867 Mbps PHY data rates. These solutions can be coupled with external MCUs from popular vendors or Linux on application processors to implement a complete Wi-Fi + Bluetooth® system.
Responding to a growing focus on embedded systems amongst attackers, Infineon offers OPTIGA™ Trust hardware security solutions based on a high-end security controller optimized for connected devices. It provides extremely flexible, high-performance, and secured access to any major cloud provider.
Predictive maintenance enables a data-driven approach to predict and prevent device failures based on pattern recognition and intelligent software models. To collect the necessary data and enable monitoring of the condition of devices in a building, smart XENSIV™ sensors help to record the most crucial parameters of a device’s status.
Infineon's latest generation of fixed-frequency CoolSET™ AC-DC integrated power stages with quasi-resonant switching scheme offers increased robustness and excellent performance. Infineon's fixed-frequency CoolSET™ offers higher efficiency and lower switching frequency at medium and light loads, enabled by an integrated frequency step-down.
Our latest solid-state RF-powered microwave oven solution helps consumers achieve a better cooking experience. It offers precise cooking, improved food quality, greater consistency, selective heating, and versatile and complex cooking combinations.
The OptiMOS™ 5 technology together with the 600 V CoolMOS™ P7 enables you to use one or several 250 W units to build a microwave oven with the desired power level. RF power transistors and architectures provide a full range of power control, phase shifting, and frequency adjustments, allowing microwave ovens to cook complex combinations. Also, 30 V operational voltage improves safety and replaces the magnetron’s 4 kV power supply.
CoolSiC™ 650 V Schottky diodes offer the best price and performance ratio and customer value on the market. Based on advanced silicon carbide production equipment, a solid track record, the highest quality, and a very granular and complete combined G5 and G6 portfolio. With more compact packages and thin wafer technology, they complement our 650 V CoolMOS™ superjunction MOSFET families. The CoolSiC™ Schottky diodes convince with better efficiency compared to silicon diode alternatives.
The huge global market for microwaves is characterized by great competition and price pressure. Along with this, manufacturers must meet rising consumer expectations and produce more reliable, energy-efficient appliances that also offer more and more functions. Benefits such as faster cooking, advanced cooking functions, and easy cleaning and safety features play a crucial role. In addition, manufacturers are under enormous pressure to bring innovative new products to market as quickly as possible and at an attractive price and performance ratio. This is why inverter-operated microwaves in particular are enjoying great popularity. They combine high efficiency and increased power control at a favorable price. Inverterization helps reduce the stress of constantly switching the magnetron on and off, ensuring a long service life.
Infineon combines the industry-leading performance of the TRENCHSTOP™ family with the innovative reverse conducting IGBT technology to create a new generation of best-in-class devices. With a monolithically integrated diode, the RC-H IGBTs are perfectly suited for soft-switching application as inverterized microwave ovens.
Overcome ground-shift challenges in your design with Infineon's single-channel, non-isolated EiceDRIVER™ gate driver ICs, 1EDNx550x, that feature true differential inputs and guarantee high immunity against negative voltage undershoots and low dissipation. The 1EDNx550x gate driver ICs have true differential inputs. Their control signal inputs are largely independent of ground potential. Or use Infineon’s 1ED4417x EiceDRIVER™ 25-V single-channel low-side, non-isolated gate drivers with integrated overcurrent protection (OCP), fault reporting, and enable functionality in a 6-pin PG-SOT-23 package. The 1ED4417x family realizes best-in-class and fast fault reporting accuracy with OCP threshold tolerance of +/-5%.
PSoC™ 6 microcontrollers (MCUs) bridge the gap between expensive, power-hungry application processors, and low-power microcontrollers. The ultra-low-power PSoC™ 6 MCU features an Arm® Cortex® M4 CPU for high-performance AI/ML tasks such as _FP match algorithm, TFT LCD driver, voice recognition and motor control, and an Arm® Cortex® M0+ for low-power system control, Bluetooth® LE, and CAPSENSE™. With built-in security, your IoT system is protected. The built-in CAPSENSE™ technology allows you to easily implement robust touch control of buttons or displays.
Our AIROC™ Wi-Fi and Bluetooth® combos integrate IEEE 802.11a/b/g/n/ac WLAN and Bluetooth® in a single-chip solution to enable small-form-factor IoT designs. Combo solutions are available for both 1x1 SISO with up to 433 Mbps PHY data rates and 2x2 MIMO with up to 867 Mbps PHY data rates. These solutions can be coupled with external MCUs from popular vendors or Linux on application processors to implement a complete Wi-Fi + Bluetooth® system.
Responding to a growing focus on embedded systems amongst attackers, Infineon offers OPTIGA™ Trust hardware security solutions based on a high-end security controller optimized for connected devices. It provides extremely flexible, high-performance, and secured access to any major cloud provider.
Predictive maintenance enables a data-driven approach to predict and prevent device failures based on pattern recognition and intelligent software models. To collect the necessary data and enable monitoring of the condition of devices in a building, smart XENSIV™ sensors help to record the most crucial parameters of a device’s status.
Infineon's latest generation of fixed-frequency CoolSET™ AC-DC integrated power stages with quasi-resonant switching scheme offers increased robustness and excellent performance. Infineon's fixed-frequency CoolSET™ offers higher efficiency and lower switching frequency at medium and light loads, enabled by an integrated frequency step-down.
Our latest solid-state RF-powered microwave oven solution helps consumers achieve a better cooking experience. It offers precise cooking, improved food quality, greater consistency, selective heating, and versatile and complex cooking combinations.
The OptiMOS™ 5 technology together with the 600 V CoolMOS™ P7 enables you to use one or several 250 W units to build a microwave oven with the desired power level. RF power transistors and architectures provide a full range of power control, phase shifting, and frequency adjustments, allowing microwave ovens to cook complex combinations. Also, 30 V operational voltage improves safety and replaces the magnetron’s 4 kV power supply.
CoolSiC™ 650 V Schottky diodes offer the best price and performance ratio and customer value on the market. Based on advanced silicon carbide production equipment, a solid track record, the highest quality, and a very granular and complete combined G5 and G6 portfolio. With more compact packages and thin wafer technology, they complement our 650 V CoolMOS™ superjunction MOSFET families. The CoolSiC™ Schottky diodes convince with better efficiency compared to silicon diode alternatives.