S-MFC6.6

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S-MFC6.6
S-MFC6.6

Product details

  • Applications
    payment, government identification
  • Contact Surface
    NiAu
  • Delivery Forms
    Tape on Reel
  • Derivatives
    Pd surface, Au surface
  • Dimensions
    11 x 8.3mm
  • ISO – Reference
    ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Pitch
    9.5 mm
  • Product Description
    contact-based module, 6 contacts
  • Product Name
    S-MFC6.6
  • Thickness
    max. 420µm
OPN
Product Status
Infineon Package
Package Name
Packing Size
Packing Type
Moisture Level
Moisture Packing
Lead-free
Halogen Free
RoHS Compliant
Infineon stock last updated:
With the MFC6.x product series Infineon offers black lined premium Flip Chip packages with an equivalent appearance like epoxy tape.In combination with an optimized card cavtiy this products offer advantages for mechanical robustness, module flatness in card and improved image of card backside in area of module milling cavity.For the Payment market this products are also availablel with palladium surface.

Features

  • 9.5mm
  • 11 x 8.3mm
  • max. 470µm
  • NiAu
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface, Pd surface, S-MFC6.6-6-1, S-MFC6.6-6-3
  • Tape on Reel

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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