NEW
Active and preferred
RoHS Compliant

IAUCN04S7L038D

NEW
40 V, N-Ch, 3.84 mΩ max, Automotive MOSFET, Dual SSO8 (5x6), OptiMOS™7
Data Sheet
package

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IAUCN04S7L038D
IAUCN04S7L038D
Data Sheet

Product details

  • Country of Assembly
    Malaysia
  • Country of Diffusion
    Austria, Germany
  • Family
    Automotive MOSFET
  • ID (@25°C) max
    60 A
  • Launch year
    2026
  • Operating Temperature range
    -55 °C to 175 °C
  • Package
    PG-TDSON-8
  • Planned to be available until at least
    2038
  • Polarity
    N+N
  • QG (typ @10V) max
    20 nC
  • QG (typ @10V)
    15 nC
  • Qualification
    Automotive
  • RDS (on) (@10V) max
    3.84 mΩ
  • Technology
    OptiMOS™7
  • VDS max
    40 V
  • VGS(th) range
    1.2 V to 1.8 V
  • VGS(th)
    1.5 V
Recommended
OPN
IAUCN04S7L038DATMA1
Product Status active and preferred
Infineon Package
PG-TDSON-8
Package Name Dual SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TDSON-8
Package Name Dual SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The new automotive OptiMOS™7 40 V dual SSO8 MOSFET is offered in our reliable SSO8 5x6mm2 SMD package. It features two independent N-channel MOSFETs integrated in one package for PCB area savings. It is designed specifically for high performance, high quality and the robustness needed for demanding and cost-efficient power automotive applications. The new portfolio provides a wide RDS range from 1.94 mΩ to 5.59 mΩ combined with an increased current rating of 60 A.

Features

  • 5x6 mm2 small footprint
  • 60 A high current capability
  • Leading-edge OptiMOS™7 40 V technology
  • RDS range: 1.94mΩ to 5.59 mΩ
  • Leadless package with Cu-clip for lowest package resistance & minimized stray inductance
  • High avalanche capability

Benefits

  • High thermal capacity leadframe package
  • Reduced conduction losses
  • Optimized switching behavior
  • Reduced form factor compared to traditional leaded packages
  • Industry standard package (JEDEC standard PG-TDSON-8)

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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