Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
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END OF LIFE
discontinued
RoHS Compliant
Lead-free

CY7C2263XV18-600BZXC

END OF LIFE
Data Sheet
package
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CY7C2263XV18-600BZXC
CY7C2263XV18-600BZXC
View replacement
Data Sheet

Product details

  • Architecture
    QDR-II+ Xtreme
  • Bank Switching
    N
  • Burst Length (Words)
    4
  • Data Width
    x 18
  • Density
    36 MBit
  • ECC
    N
  • Family
    QDR-II+ Xtreme
  • Frequency
    600 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Ag/Cu
  • On-Die Termination
    Y
  • Operating Temperature
    0 °C to 70 °C
  • Operating Voltage
    1.7 V to 1.9 V
  • Organization (X x Y)
    2Mb x 18
  • Peak Reflow Temp
    260 °C
  • Qualification
    Commercial
  • Read Latency (Cycles)
    2.5
OPN
CY7C2263XV18-600BZXC
Product Status discontinued
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 680
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
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Product Status discontinued
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 680
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
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Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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